Alliedsignal Inc.

Jiri D Konicek

Donald E Yuhas

David P Groppi

Carol L Vorres

Joseph J Zupancic

Jeffrey P Conrad

Aroon Vishwanath Tungare

Amy L Moe

Robert P Smith

Jerry C Zeroth

Epoxy resin compositions used in preparation of laminates for electronic applications are free of the solvents typically needed in current industrial practice. The use of certain mono-substituted dicyandiamides makes possible the elimination of such solvents since all of the components are soluble in epoxy resin to an extent which provides uniform properties in the cured laminates.

Solvent free epoxy resin compositions containing substituted

A method for making multilayer laminates having at least one exposed layer of copper foil. The exposed layer of copper foil is covered with a adhesively attached protective metal sheet made of a copper prior to being laminated.

Copper foil laminate for protecting multilayer articles

Dimensionally stable laminates of epoxy resin reinforced with glass fibers have a coefficient of thermal expansion which matches that of copper, making possible copper foil covered laminates which provide improved registration in multilayer printed circuit boards. New glass fabric styles provide balanced thermal expansion in both the warp and fill directions.

System of electronic laminates with improved registration properties

The degree of cure and the amount of epoxy resin in a glass fiber reinforced epoxy resin prepreg is measured by exposing the prepreg to a series of light pulses created by optical filters transmitting light at predetermined bandwidths about selected wavelengths, preferably centered at wavenumbers of about 4529 cm.sup.-1 and 4055 cm.sup.-1 and measuring the amount of epoxy groups and methyl groups present relative to reference values from the electrical pulses produced by a phase sensitive photoelectric detector disposed to receive said light pulses after being exposed to said prepreg. When such measurements are made in a continuously moving sheet of prepreg, it is possible to control the variation of percent cure and resin content to no greater than .+-.3% cure and .+-.3% resin content over a distance of at least 400 yds (366 m).

Process for measurement of the degree of cure and percent resin of

A system of conveyors and handlers for manufacturing copper clad laminates is disclosed. The system has a layup station including at least two clean rooms in which B-stage and copper foil sheets are respectively placed. A sandwich comprising a copper foil sheet placed into contact with a press plate is conveyed from the first to the second clean room where a B-stage sheet is positioned against the copper foil. The resulting uncured laminate is then transferred with its press plate to a stacking station until a predetermined number of laminates, separated by press plates, is stacked into a 'book'. One or more books are then conveyed through press loading equipment where heat and pressure are applied to cure the laminates. The books are then transferred to a breakdown station where the cured laminates and press plates are successively and sequentially stripped from the book. The press plates are conveyed back to the layup station for recycling into 'new' books with each press plate cleaned immediately prior to reentering the first clean room. To minimize the migration of B-stage dust or fibers from the second to the first clean room, the ambient atmospheric air pressure within the first clean room is maintained at a greater pressure than the air pressure within the second clean room.

Growing community of inventors

Onalaska, WI, United States of America

Jiri D Konicek