Utac Headquarters Pte. Ltd.

Jiraphat Charoenratpratoom

Phongsak Sawasdee

Paweena Phatto

Eakkasit Dumsong

Wannasat Panphrom

Maythichai Saithong

Mike Jayson Candelario

An embodiment related to a package is disclosed. The package includes a component mounted to a die attach region on a package substrate. A passive component with first and second passive component terminals is vertically attached to the package substrate. An encapsulant is disposed over the package substrate to encapsulate the package. In one embodiment, an external component is stacked above the encapsulant and is electrically coupled to the encapsulated package.

Semiconductor packages with vertical passive components

A semiconductor package and method for forming thereof are disclosed. The package includes a package substrate having a die cavity with a die attached therein. The package substrate also includes a cavity for bonding a cap thereto to form a hermetic package. The cap is bonded to the cavity using sealing rings.

Hermetic semiconductor packages

Growing community of inventors

Bangkok, Thailand

Jiraphat Charoenratpratoom