Freescale Semiconductor,inc.

Nxp Usa, Inc.

Nxp B.v.

Freescale Semiconductor, Inc. Austin

Jinzhong Yao

Zhigang Bai

Xingshou Pang

Xuesong Xu

Nan Xu

Junhua Luo

Lan Chu Tan

Meng Kong Lye

Zhijie Wang

Jun Li

Wai Yew Lo

Baoguan Yin

Jianhong Wang

Yuan Zang

Bin Tian

Leo M Higgins, Iii

Zhiwei Gong

Burton Jesse Carpenter

Fred T Brauchler

Wei Gao

Mariano Layson Ching, Jr

Dehong Ye

Hui Wang

Jinmei Liu

Meijiang Song

Shufeng Zhao

Wanming Yu

Yongsheng Lu

Yadong Wei

Yanting Tian

Mingchuan Han

Jian Song

An integrated circuit package is formed by positioning an integrated circuit die on a die pad of a leadframe; connecting a bond wire between the die and a bond pad of the leadframe; encapsulating the bond wire, die, and bond pad with an encapsulant material to form a first mold cap of the integrated circuit package; after the encapsulating, bending one or more leads of the leadframe to form one or more bent leads; and encapsulating the first mold cap and a portion of a bend of the one or more bent leads with the encapsulant material to form a second mold cap.

Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package

A mold chase has first and second mold clamps having corresponding teeth and recesses configured such that, when the mold chase is closed onto a sub-assembly having an IC die mounted onto and wire-bonded to a lead frame, there are gaps between the recesses and the leads of the lead frame that allow molding compound to extend along opposing sides of proximal ends of the leads to increase the metal-to-metal distance between adjacent leads, thereby reducing the chances of, for example, tin migrating during HAST testing to form undesirable conduction paths between adjacent leads. In some embodiments, the mold clamp teeth have chamfered edges that are tapered at the mold chase cavity to form wedge-shaped gaps that allow the molding compound to extrude along the proximal ends of the leads of MaxQFP packages having two levels of 'J' leads and gullwing leads.

Protection from metal migration on IC packages

A lead frame for a packaged integrated circuit (IC) device has a die receiving area and leads that extend outwardly from the die receiving area. The leads have an inner lead area proximate the die receiving area and an outer lead area distant from the die receiving area. Notches are formed in a surface of alternate ones of the leads, in the inner lead area proximate to the outer lead area. The notches facilitate bending of the alternate leads when the leads are subjected to a downward force by a mold tool, such that one set of leads lies in a first plane and another set lies in a second plane spaced from the first plane. The leads in the first plane can be formed into Gull Wing leads and the other set of leads into J-leads.

Lead frame with bendable leads

A packaged integrated circuit (IC) device includes a first IC die with a first inductor, a first layer of adhesive on a first major surface of the first IC die, an isolation layer over the first layer of adhesive, a second layer of adhesive on the isolation layer, a second IC die on the second layer of adhesive, and a second inductor in the second IC die aligned to communicate with the first inductor. The isolation layer extends a prespecified distance beyond a first edge of the second IC die.

Packaged integrated circuit having stacked die and method for therefor

A method of assembling QFP devices includes providing a lead frame having leads that extend from a dam bar to a die flag, and performing a first molding process that fills spaces between the leads and between the dam bar and the die flag with a first mold compound. The first mold compound also forms a ring around the die flag, where the ring extends from both lateral sides of the lead frame. A first area around the die flag is removed to separate the leads from the die flag, and a second area near an inner corner of the dam bar is removed to form a mold gate. A die is attached to the die flag and electrically connected to the leads with bond wires, and then a second molding process is performed to encapsulate the die, bond wires and inner leads.

Method of assembling QFP type semiconductor device

A lead frame for a packaged integrated circuit (IC) device has alternating first and second leads that protrude from a package body in respective first and second planes, where the second plane is parallel to and below the first plane. The first leads are formed into Gull Wing shaped leads and the second leads are formed into J-shaped leads. Inner lead portions of the first and second leads are maintained in the first plane with a tape. An inner lead portion of each of the second leads, proximate to and extending to the outer lead portion, is down-set, so that when the outer lead portion is pressed down by a mold tool to locate the outer lead portion of the second leads in the second plane, the inner lead portion of the second leads is maintained in the first plane and does not separate from the tape.

Lead frame for integrated circuit device having J-leads and Gull Wing leads

A lead frame for a packaged integrated circuit (IC) device has alternating first and second leads that protrude from a package body in respective first and second planes, where the second plane is parallel to and below the first plane. The first leads are formed into Gull Wing shaped leads and the second leads are formed into J-shaped leads. Inner lead portions of the first and second leads are maintained in the first plane with a tape. An inner lead portion of each of the second leads includes a deformation area that facilitates maintaining the tape in contact with the inner lead area of the second leads, even when a mold tool presses down on an outer lead side of the second leads to place the outer lead ends of the second leads in the second plane.

Lead frame for integrated circuit device having J-leads and gull wing leads

Embodiments of a lead frame for a packaged semiconductor device are provided, one embodiment including: a die pad; a first row of active lead fingers that are laterally separated from one another along their entire length; a package body perimeter that indicates placement of a package body of the packaged semiconductor device, wherein the package body perimeter is located laterally around the die pad; a first dummy lead finger positioned in parallel next to an initial active lead finger of the first row of active lead fingers, wherein the first dummy lead finger and the initial active lead finger are laterally separated from one another along their entire length, and wherein the first dummy lead finger is separated from the package body perimeter by a gap distance; and a first tie bar connected to an outside edge of the first dummy lead finger.

Lead frame with dummy leads for burr mitigation during encapsulation

A semiconductor sensor device is assembled using a lead frame having a flag surrounded by lead fingers. A pressure sensor die is mounted on the flag and electrically connected to the leads. Prior to encapsulation, a pre-formed block of gel material is placed over the sensor region on the die. Encapsulation is performed and mold compound covers the pressure sensor die and the bond wires. Mold compound covering the gel block may be removed. Additionally, a trench may be formed around an upper portion of the gel block so that the lateral sides of the gel block are at least partially exposed.

Cavity type pressure sensor device

A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.

Combined QFN and QFP semiconductor package

Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.

Floating mold tool for semicondcutor packaging

An integrated circuit package has an exposed die pad with a trench and openings in the trench that are filled with encapsulant to form an encapsulant ring near the edges of the die pad. During assembly, the encapsulant passes through the openings and fills the trench to form the encapsulant ring. The ring helps to keep the die pad from separating from the encapsulant caused by thermal cycling. Air vents might be included in the die pad surface to allow air to escape from the trenches and the openings as they fill with encapsulant. Trenches from the openings to the die pad edge on the chip-side of the die pad might be included to increase adhesion of the encapsulant to the die pad.

Exposed pad integrated circuit package with mold lock

A Quad Flat Non-leaded (QFN) semiconductor package has a semiconductor die mounted on a die flag of a lead frame. A molded housing with a base and sides covers the die. The package has electrically conductive mounting feet each of which includes an exposed base surface in the base of the housing, an opposite parallel surface covered by the housing, and an exposed end surface in the one of the sides of the housing. The exposed end surface is normal to, and located between, the exposed base surface and the opposite parallel surface. Bond wires selectively electrically connect electrodes of the die to respective ones of the mounting feet. An electrically conductive plating coats the exposed base portion and exposed end surface of the mounting feet.

Quad flat non-leaded semiconductor package with wettable flank

A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90&#xb0; angles. The mold columns prevent the corner pads from peeling.

Non-leaded type semiconductor package and method of assembling same

A quad flat package integrated circuit (IC) device has alternating inner and outer leads that protrude from a package body. The inner leads are j-shaped leads and the outer leads are gull-wing shaped leads. The package body is formed such that it includes plastic lead webbings between adjacent leads, which help prevent metal particles from getting lodged between the leads and causing electrical shorts. The webbings are made of the same molding compound as the package body and are formed together with the package body.

Growing community of inventors

Tianjin, China

Jinzhong Yao