Lg Chem, Ltd

Jinyoung Park

Chan Hyo Park

Danbi Choi

Kyunghwan Kim

Hye Won Jeong

Jinho Lee

Cheolmin Yun

Ye Ji Hong

Hoyong Lee

Kyungjun Kim

Bora Shin

Cheol Jun Song

Chae Won Park

Minju Kim

Takashi Yamashita

Su Kyeong Kim

Takashi Kino

The present disclosure is directed to providing a support substrate for a display device capable of obtaining high transparency while accomplishing thinning and flexibility of an organic EL display device. In view of the above, the present disclosure provides a support substrate for a display device including a TFT glass substrate having a thickness of 10 μm to 150 μm, and a polyimide resin layer having a thickness of 150 nm or less installed in contact with the TFT glass substrate.

Support substrate for display device, organic EL display device, and manufacturing method for organic EL display device

The present invention relates to a polyimide precursor composition, and a polyimide film manufactured using same. According to the present invention, since a polyimide film is manufactured from a mixture of a polyimide precursor having a structure that is advantageous to surface charge accumulation and a polyimide precursor having a structure capable of exhibiting high heat-resistant characteristics, a flexible device using the polyimide film as a substrate can have both improved charge accumulation characteristics caused by an electric field to be generated during the operation of a TFT device and heat high heat-resistant characteristics.

Polyimide precursor composition and polyimide film manufactured using same

Disclosed is a novel diamine compound in which an imide ring is directly bonded to a (hetero)aryl ring in a molecule, and a polyimide film prepared by polymerizing the novel diamine compound exhibits improved thermal properties and storage stability.

Diamine compound, and polyimide precursor and polyimide film using same

The present invention relates to a polyimide film showing a low stress change rate on a silicon wafer. The present invention can minimize cracks which are formed due to the stress change of polyimide, in a process for depositing an inorganic film on a polyimide substrate at a high temperature, and thus can reduce electrical property degradation such as a recoverable residual image and decrease in current of a flexible display.

Polyimide film for display substrate

Provided according to the present invention is a substrate for a flexible display device in which the problems of threshold voltage shift-induced current fluctuation and resultant image sticking can be solved by introducing an imide monomer as an organic filler into a polyamic acid composition to enhance thickness and surface direction densities in the film that is manufactured while vulcanization is performed at high temperatures, thereby enhancing thermal diffusivity and thermal conductivity of the film.

Polyimide film having improved thermal conductivity and manufacturing method therefor

The present invention employs a polyimide film, which has a coefficient of thermal expansion (CTE) that is a negative number at a temperature equal to or greater than 350&#xb0; C., as a debonding layer for separating a flexible substrate and a carrier substrate, and thus can easily separate a flexible substrate from a carrier substrate by using a detaching phenomenon caused by a difference in residual stress between the flexible substrate and the debonding layer after a high-temperature process for producing an element on the flexible substrate. Therefore, the present invention can separate the flexible substrate without causing chemical or physical damage to the element formed on the flexible substrate, thereby minimizing problems that may occur during a stripping process.

Laminate for manufacturing flexible display, and flexible display manufacturing method using same

A polyimide film according to the present invention can be effectively used as a substrate for a flexible display device without a deterioration in heat resistance even at a temperature of 350&#xb0; C. or higher since a coefficient of thermal expansion (A) in the section of 100-350&#xb0; C., of the polyimide film, and a coefficient of thermal expansion (B) in the section of 350-450&#xb0; C., of the polyimide film, meet 0&#x3c;B/A&#x3c;2.

Polyimide film for flexible display device substrate

The present invention relates to the production of a polyimide precursor, whereby, by using an amide-based organic solvent having a positive-number partition coefficient (Log P) and a density of at most 1 g/cm3, an interaction between the organic solvent and polyamic acid, which is a polyimide precursor, may be mitigated, thereby enabling the decrease of the viscosity of a polyimide precursor solution, and thus enabling a polyimide precursor solution having high solid content and low viscosity to be obtained.

Polyimide precursor solution and polyimide film produced using same

The present invention provides a display substrate polyimide film having: remarkably improved insulation characteristics; inner pores, included in the polyimide film, of which the maximum size is 10 nm or less; and a high maximum dielectric breakdown voltage of 350 V/&#x3bc;m or more. The polyimide film according to the present invention has improved insulation characteristics so as to be capable of suppressing the generation of a current fluctuation of TFTs according to the long-term driving of a TFT device in a display such as an OLED, thereby enabling the deterioration of the contrast of a display to be reduced.

Growing community of inventors

Daejeon, South Korea

Jinyoung Park