Murata Manufacturing Co., Ltd.

Jinya Furui

Takashi Yamamoto

Masaki Fukuda

Takashi Inoue

Yuji Fukada

Isao Ikeda

A crystal-oscillating device is disclosed with a reduction in size and a favorable Q value. The crystal-oscillating device includes a first packaging material; a crystal resonator mounted on the first packaging material; joining members that join the first packaging material to the crystal resonator; a first sealing frame for joining the second and third packaging materials, the first packaging material, and the second packaging material; and a second sealing frame for joining the second packaging material and the third packaging material to each other. Preferable, the second packaging material is formed in a frame shape to surround an outer peripheral edge of the crystal resonator, and the second packaging material and a crystal substrate of the crystal resonator are formed from the same crystal substrate.

Crystal-oscillating device and manufacturing method therefor

A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode, a second metal terminal connected to the second external electrode, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. Upper and lower surfaces of the exterior material are flat or substantially flat.

Surface mount electronic component

A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode by solder, a second metal terminal connected to the second external electrode by the solder, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. The solder satisfies a relational expression: element diameter D (mm)&#xd7;about 0.003 mm&#x2264;solder cross-sectional area S (mm)&#x2264;element diameter D (mm)&#xd7;about 0.02 mm.

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Nagaokakyo, Japan

Jinya Furui