Western Digital Technologies, Inc.

Sandisk Information Technology (Shanghai) Co., Ltd.

Sandisk Semiconductor (Shanghai) Co. Ltd.

JinXiang Huang

Chih-Chin Liao

Chin-Tien Chiu

Li Ping Wang

Jianhua Wang

Xuyi Yang

Kim Lee Bock

Shineng Ma

Ye Bai

Cheng-Hsiung Yang

King Hoo Ong

Songtao Lu

Enyong Tai

Pradeep Rai

Yuequan Shi

A memory card includes a memory card body dimensioned to house at least one integrated circuit die package. The memory card body, in certain embodiments, includes a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface. The memory card also includes a contact pad disposed on at least one side surface of the plurality of side surfaces. The contact pad includes a first conductive layer, a second conductive layer, and an insulating layer disposed between the first conductive layer and the second conductive layer.

Side contact pads for high-speed memory card

Devices and methods are described for reducing etching due to galvanic effect within a printed circuit board that may be used, for example, in a data storage device, such as a card-type data storage device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trance, and that is configured to couple the data storage device to a host device. The contact trace is electrically isolated from the rest of the circuitry during a fabrication process. The contact finger and an exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to an impedance trace though at least one of a component and a bond wire.

Printed circuit board trace for galvanic effect reduction

A tool is disclosed for separating a semiconductor die from a tape to which the die is affixed during the wafer dicing process. The tool includes a pick-up arm for positioning a vacuum tip over a semiconductor die to be removed. The vacuum tip includes a non-uniform array of vacuum holes to grip the semiconductor wafer.

Non-uniform vacuum profile die attach tip

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Shanghai, China

JinXiang Huang