Lg Electronics Inc.

Samsung Electronics Co., Ltd.

Arkema France

Sk Microworks Co., Ltd.

Haier US Appliance Solutions, Inc.

Ykk Corporation

University of Seoul Industry Cooperation Foundation

Samsung Display Co., Ltd.

Osong Medical Innovation Foundation, Korea University Research and Business Foundation

Zkw Group Gmbh

Jinwoo Park

Jihyun Lee

Jaeho Lee

Jihwan Kim

Miyoung Kim

Youngjun Kim

Jongho Lee

Jiyoung Park

Choongbin Yim

Teakhoon Lee

Kwangho Jang

Hoshik Lee

Jongbo Shim

Chung Gu Kang

Yeongkwon Ko

Samsick Kim

Hojae Jung

Inyong Hwang

Il Young Park

Atsushi Yoshitake

Chaseung Jun

Min-Joong Lee

Jihwang Kim

Younhwa Choi

Jungeun Shin

Junghyeon Cho

Jungmin Cha

Seunghak Kim

Hoseok Chung

Hyojin Choi

Jaekyung Yoo

Minhun Kang

Geunhyeong Kim

Hyungsun Kim

Sangchul Han

Seulah Lee

Kiwan Kim

Shinjun Park

Jongsup Kim

Sooyoung Her

Taekon Lee

Kweonhyung Han

Myoeng Soo Park

Sangju Lee

Taewoong Kong

Hyunsoo Min

Byung Deok Yu

Junjin Jeon

Yeseul Jang

Victoria Bondarchuk

Naoki Kasuya

Sebastien Merzlic

Kiwon Kwak

Dayeong Kim

Daisuke Satake

Sooil Chin

Akira Sato

Myeong Soo Park

Lee Jaeho

A method of operating a cooktop appliance includes receiving an input at a user interface of the cooktop appliance and initiating a cooking operation of the cooktop appliance in response to the input. The method further includes determining, after initiating the cooking operation, whether a protected user is present at the cooktop appliance and an authorized user is absent from the cooktop appliance.

Cooktop appliance with protected user detection

A semiconductor package includes: a package substrate; a semiconductor chip mounted above the package substrate; a chip connection terminal interposed between the semiconductor chip and the package substrate; an adhesive layer disposed on the package substrate and that covers a side and a top surface of the semiconductor chip and surrounds the chip connection terminal between the semiconductor chip and the package substrate; a molding layer disposed on the package substrate and that surrounds the adhesive layer; an interposer mounted on the adhesive layer and the molding layer, where the interposer includes an interposer substrate; and a conductive pillar disposed on the package substrate, where the conductive pillar surrounds the side of the semiconductor substrate, penetrates the molding layer in a vertical direction and connects the package substrate to the interposer substrate.

Semiconductor package and manufacturing method thereof

A decoding method includes receiving an input sequence corresponding to an input speech at a current time; and in a neural network (NN) for speech recognition, generating an encoded vector sequence by encoding the input sequence, determining reuse tokens from candidate beams of two or more previous times by comparing the candidate beams of the previous times, and decoding one or more tokens subsequent to the reuse tokens based on the reuse tokens and the encoded vector sequence.

Method and apparatus with decoding in neural network for speech recognition

A semiconductor package includes a first package substrate having a lower surface and an upper surface respectively including a plurality of first lower surface pads and a plurality of first upper surface pads, a second package substrate having a lower surface and an upper surface respectively including a plurality of second lower surface pads and a plurality of second upper surface pads, wherein the plurality of second upper surface pads comprise all of the upper surface pads at the upper surface of the second package substrate, a semiconductor chip provided between the first package substrate and the second package substrate and attached onto the first package substrate, and a plurality of metal core structures connecting some of the plurality of first upper surface pads to some of the plurality of second lower surface pads and not vertically overlapping any of the plurality of second upper surface pads, each metal core structure having a metal core.

Semiconductor package

The present disclosure relates to a power converting device and a home appliance including the same. A power converting device according to an embodiment of the present disclosure comprises a first capacitor, a first switching element turned on to output a first voltage stored in the first capacitor to a first node which is one end of an inductive load, a second switching element, one end of which is connected to the first switching element and which is turned on to decrease the voltage of the first node to the first voltage, a third switching element turned on to output a second voltage greater than the first voltage to the first node which is one end of the inductive load, and a fourth switching element, one end of which is connected to the third switching element and which is turned on to decrease the voltage of the first node to the ground voltage. Accordingly, switching loss may be reduced when power is supplied to an inductive load.

Power converting device and home appliance including the same

An electric range is provided, in which filter circuits are disposed at an edge of a lower end of a case and are spaced a maximum distance apart from a plurality of working coils, thereby reducing noise generated by the working coils as much as possible and improving performance of the filter circuits.

Electric range

This vehicle seat assembly device includes: a base section; a cushion working section that is connected to one side of the base section and that can place a seat cushion in which a plurality of first through holes are formed; and a cover working section that is connected to the other side of the base section, that places a seat cover, and that can transfer the seat cover to the upper part of the seat cushion. The cushion working section fixes a clip, which is connected to a suspender of the seat cover, to a wire positioned at the lower part of the seat cushion.

Vehicle seat assembly device

A semiconductor package includes a package substrate, an interposer provided on the package substrate, a plurality of semiconductor devices on the interposer to be spaced apart from each other, the semiconductor devices being electrically connected to the package substrate through the interposer, and a molding layer on the interposer covering the semiconductor devices and exposing upper surfaces of the semiconductor devices, the molding layer including at least one groove extending in one direction between the semiconductor devices, the groove having a predetermined depth from an upper surface of the molding layer.

Semiconductor package and method of manufacturing semiconductor package

Disclosed is a flexible display apparatus characterized by comprising: a first body; a flexible display configured to be inserted into the first body or withdrawn from the first body, while being deformed by an external force; a second body coupled to one end of the flexible display; and a rear surface plate coupled to a rear surface portion of the flexible display and configured to deform together with the flexible display, wherein the flexible display deforms so as to be windable while being inserted into the first body, and deforms so as to be unfolded while being withdrawn from the first body.

Flexible display apparatus

An electric range is provided. The electric range may include a case; at least one heating unit configured to heat an object; at least one drive circuit configured to drive the heating unit; at least one display configured to display visual information; at least one air blowing fan configured to output air; and at least one air guide configured to guide air output from the air blowing fan to the drive circuit. The air output from the air blowing fan may be supplied to a first end of the air guide, and a height of an upper surface of the first end of the air guide may be greater than a height of an upper surface of the air blowing fan. A first portion of the air output from the air blowing fan may be discharged through a gap between the upper surface of the first end of the air guide and the upper surface of the air blowing fan, and supplied to the display.

Electric range and air guide for electric range

An electric range is provided that may include an air guide provided with a first member that prevents air, output from an air blowing fan, from flowing into a space between a lower surface of a case and a drive circuit.

Example embodiments relates to a film having excellent mechanical properties with excellent optical properties such as refractive index, haze, yellow index, and the like, light transmitting laminate, use as a cover film, a multi-layered electronic device, and the like comprising the same. The film comprises an elastic layer, the elastic layer has a refractive index of 1.48 to 1.58, a low temperature damage index is a difference of a tensile modulus and a tensile strength at a certain temperature, and the elastic layer has a low temperature index of 1,300 MPa or less.

Films, light transmitting laminate, cover films and multi-layered electronic devices

A cooking appliance may include a holder disposed in an induction heating element provided below a cover plate, and a supporter disposed inside the holder that supports a sensor inserted into the holder to contact the sensor to the cover plate.

Cooking appliance

A method of manufacture for a semiconductor package includes; forming a molding member on side surfaces of the semiconductor chips, using an adhesive to attach a carrier substrate to upper surfaces of the molding member and the semiconductor chips, using a first blade having a first blade-width to cut away selected portions of the carrier substrate and portions of the adhesive underlying the selected portions of the carrier substrate, and using the first blade to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are dispose above portions of the molding member between adjacent ones of semiconductor chips, using a second blade having a second blade-width narrower than the first blade-width to cut through a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separate a package structure including a semiconductor chip supported by a cut portion of the carrier substrate and bonding the package structure to an upper surface of a package substrate.

Semiconductor package and method of manufacture

A film, a manufacturing method of the film, a cover film, and a multi-layered electronic device include an elastic layer having a storage modulus index Kof 20 to 350 Mpa represented by Equation 1 below and a haze of 3% or less, thereby providing the film having substantially low storage modulus variations over a wide temperature range, with good mechanical properties such as excellent elastic recovery force and good optical properties such as low haze, and provide the cover film or the multi-layered electronic device including the same.

Film, film manufacturing method, cover film, and multilayer electronic equipment

Growing community of inventors

Seoul, South Korea

Jinwoo Park