International Business Machines Corporation

Georgia Tech Research Corporation

Jinwoo Choi

Mahesh Bohra

Kevin Bills

Rohan U Mandrekar

Roger Donell Weekly

Lloyd Andre Walls

Sungjun Chun

Bhyrav M Mutnury

Daniel Mark Dreps

Moises Cases

Yanyan Zhang

Tae Hong Kim

Jason Lee Frankel

Paul Robert Walling

Anand Haridass

Wiren Dale Becker

Madhavan Swaminathan

Tingdong Zhou

Caleb James Wesley

Navraj Singh

Vinu Govind

Mehdi Mohamed Mechaik

Tae Tong Kim

Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer includes a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor have a matching orientation and separation distance from a source to a destination.

Method of producing printed circuit boards with routing conductors and dielectric strands

An electronic package including modulated mesh planes can reduce crosstalk between adjacent signal wires. Modulated mesh planes above and below a wiring plane include sets of adjacent wires arranged parallel to signal wires within the wiring plane, and sets of adjacent wires arranged perpendicular to the signal wires. The wires in each of the mesh planes are electrically interconnected and insulated from the signal wires by a dielectric layer. The electronic package also includes a region of the mesh planes having the adjacent wires that are perpendicular to the signal wires separated by a first distance, and another region of the mesh planes having adjacent wires perpendicular to the signal wires separated by a distance greater than the first distance. A set of rectangular mesh areas of the mesh planes can be populated with supplemental wires and via interconnect structures which can further reduce crosstalk.

Multilayer ceramic electronic package with modulated mesh topology and alternating rods

An electronic package can include modulated mesh planes for reducing crosstalk between adjacent signal wires within the electronic package. Modulated mesh planes above and below a wiring plane can include sets of adjacent wires arranged in an orientation parallel to signal wires within the wiring plane, and sets of adjacent wires arranged in an orientation perpendicular to the signal wires. The sets of wires in each of the mesh planes are each electrically interconnected and insulated by a dielectric layer from the signal wires. The electronic package also includes a region of the mesh planes having the adjacent wires that are arranged in an orientation perpendicular to the signal wires separated by a first distance, and another region of the mesh planes having adjacent wires perpendicular to the signal wires separated by a distance greater than the first distance.

Multilayer ceramic electronic package with modulated mesh topology

Embodiments are directed to a printed circuit board and a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material, an intermediate layer positioned adjacent to the dielectric material, and a conductor positioned adjacent to the intermediate layer. The intermediate layer is comprised of fiberglass strands having an associated orientation. When assembled, the fiberglass of the intermediate layer and the conductor having a matching orientation and separation distance from a source to a destination.

Printed circuit board with routing of a conductor and dielectric strands

A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.

Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures

A method amplifies a signal on a transmission line. A driver transmits an initial signal on a transmission line, which is overlaid on an Alternating Impedance-Electromagnetic BandGap (AI-EBG) structure (i.e., a reference plane) on a circuit board. The AI-EBG structure induces an alternating change to an impedance in the transmission line. The alternating change to the impedance creates a reflection signal to an initial signal on the transmission line, and the reflection signal and the initial signal combine to create an amplified signal.

Signal amplification using a reference plane with alternating impedance

A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Coreless multi-layer circuit substrate with minimized pad capacitance

An electronic structure includes a conductor layer; an insulation layer adjacent to the conductor layer; an Alternating Impedance Electromagnetic Bandgap (AI-EBG) layer adjacent to the conductor layer; and a signal driver, a transmission line, and a destination device overlaid on the AI-EBG layer, such that the AI-EBG layer induces an alternating change to an impedance in the transmission line. The alternating change to the impedance creates a reflection signal to an initial signal on the transmission line, and the reflection signal and the initial signal combine to create an amplified signal.

A method includes manipulating at least one electric signal received from one or more electronic components to provide a slope substantially proportional to a discrete integer data value of n discrete integer data values, n being a positive integer greater than or equal to 3, said discrete integer data value represented by using one of n distinct slopes, said one of n distinct slopes to be transmitted utilizing a particular reference voltage of n predetermined reference voltages. The method further includes transmitting data as the particular reference voltage of the n predetermined reference voltages to at least one electronic component utilizing slope manipulation.

Reduced wiring requirements with signal slope manipulation

The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed.

High speed differential wiring in glass ceramic MCMS

An improved multi-layered ceramic package includes a plurality of signal planes, each having one or more signal lines; a plurality of vias, each providing one of a voltage (Vdd) power connection or a ground (Gnd) connection; and at least one reference mesh plane adjacent to one or more signal planes. The reference mesh plane includes spaced mesh lines that are separated by spaces that alternate in a narrow-wide or wide-narrow pattern. A multi-layered ceramic package, using the mesh plane with alternating spaces, generates significantly lower far-end (FE) noise in the ceramic package than a conventional mesh plane with constant spaces. The noise is further reduced by placing shield lines on opposite sides of signal lines in the signal plane. A method, computer system, and program code that generate the design for the multi-layered ceramic package are also disclosed.

Growing community of inventors

Austin, TX, United States of America

Jinwoo Choi