Osaka University

Senju Metal Industry Co., Ltd.

Sharp Kabushiki Kaisha Corporation

Showa Denko K.k.

Jinting Jiu

Hiroshi Uchida

Kenji Shinozaki

Katsuaki Suganuma

Minoru Ueshima

Wanli Li

Hideki Ohata

Hiroya Sato

Masanao Hara

Yoshie Tachibana

Seiichiro Kihara

Tomotoshi Satoh

Teppei Araki

Tetsu Takemasa

Shijo Nagao

Eri Okazaki

Masaya Nogi

Aiji Suetake

Tohru Sugahara

Junko Seino

In the joined body () in which the conductor () and the substrate () are joined by the joining material (), the joining material () includes a sintered body formed by sintering silver powder. A sintered body having a porosity of 8% to 30% and a surface roughness Ra of a joining surface of 500 nm or more and 3.3 μm or less is adopted.

Joining material, production method for joining material, and joined body

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 μm or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 μm or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

An object of the present invention is to provide an electrically conductive paste and a sintered body thereof having a low electric resistance value and excellent electrical conductivity when made into a sintered body. An electrically conductive paste comprising: a flake-like silver powder having a median diameter D50 of 15 &#x3bc;m or less; a silver powder having a median diameter D50 of 25 &#x3bc;m or more; and a solvent,

Electrically conductive paste and sintered body

An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 &#x3bc;m or more and 15 &#x3bc;m or less and having a median diameter D50 of 2 &#x3bc;m or more and 5 &#x3bc;m or less; a silver powder B having a particle size in the range of 25 &#x3bc;m or more and 100 &#x3bc;m or less and having a median diameter D50 of 30 &#x3bc;m or more and 40 &#x3bc;m or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.0 parts by mass based on 100 parts by mass in total of the flake-like silver powder A, the silver powder B, and the silver powder C.

Electrically conductive paste, laminated body, and method for bonding Cu substrate or Cu electrode to electrical conductor

A method for synthesizing a copper-silver alloy includes an ink preparation step, a coating step, a crystal nucleus formation step and a crystal nucleus synthesis step. In the ink preparation step, a copper salt particle, an amine-based solvent, and a silver salt particle are mixed, thereby preparing a copper-silver ink. In the coating step, a member to be coated is coated with the copper-silver ink. In the crystal nucleus formation step, at least one of a crystal nucleus of copper having a crystal grain diameter of 0.2 &#x3bc;m or less and a crystal nucleus of silver having a crystal grain diameter of 0.2 &#x3bc;m or less is formed from the copper-silver ink. In the crystal nucleus synthesis step, the crystal nucleus of copper and the crystal nucleus of silver are synthesized.

First, a liquid mixture is obtained by mixing at least a silver compound, a reductant, and a dispersant (S). Then, the liquid mixture is heated to cause reaction between the silver compound and the reductant and generate first silver particles each having a sheet-like or plate-like shape and second silver particles each having a spherical shape or a shape closer to a sphere than the first silver particles and a particle diameter smaller than a maximum value of a length of a side of each of the first silver particles (S).

Silver particle producing method, silver particles, and silver paste

Provided is an electrode like a protruding electrode that is self-standing on a substrate. A conductive paste () contains a conductive powder, an alcoholic liquid component, and no adhesives. The conductive powder contains conductive particles having a thickness of 0.05 &#x3bc;m or more and 0.1 &#x3bc;m or less and a representative length of 5 &#x3bc;m or more and 10 &#x3bc;m or less, the representative length being a maximum diameter in a plane perpendicular to the direction of the thickness. The weight percentage of the alcoholic liquid component relative to the conductive paste is 8% or more and 20% or less.

Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structure

A method for producing copper particles includes a preparation step and a heating step. In the preparation step, a copper compound, a salt of a main group metal, and a polyhydric alcohol are prepared. In the heating step, a mixture of the copper compound, the salt of the main group metal, and the polyhydric alcohol is heated. Preferably, the main group metal is at least one selected from the group consisting of lithium, beryllium, sodium, magnesium, aluminum, potassium, calcium, zinc, gallium, germanium, rubidium, strontium, cadmium, indium, tin, antimony, cesium, and barium.

Method for producing copper particles, copper particles, and copper paste

A silver particle synthesizing method includes reducing a dispersant from first silver particles each covered with the dispersant to obtain second silver particles. The method further includes synthesizing third silver particles each having a larger particle diameter than the second silver particles by causing a reaction between a silver compound and a reductant in a liquid phase containing the second silver particles.

Silver particle synthesizing method, silver particles, conductive paste producing method, and conductive paste

Provided are a metal nanowire production method capable of producing long and thin metal nanowires, and metal nanowires produced thereby. A metal nanowire production method comprising, a step for preparing a solution containing a metal salt, a polymer, at least one selected from a group consisting of halides, sulfides, carbonates, and sulfates, and an aliphatic alcohol, and a step for heating and reacting the solution at the temperature of 100&#xb0; C. to 250&#xb0; C. for 10 minutes or more while maintaining a practical shear stress applied to the solution at 10 mPa&#xb7;m or less, wherein, during the heating and reacting step, ultraviolet-visible absorption spectrum change of the solution is measured, and a reaction time is controlled on the basis of the ultraviolet-visible absorption spectrum information.

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Jinting Jiu