Southeast University

Jintang Shang

Bin Luo

Mengying Ma

The present invention discloses a micro three-dimensional shell resonator gyroscope, a method for fabricating a micro shell resonator, a method for fabricating a composite structure substrate, and a method for fabricating a micro three-dimensional shell resonator gyroscope. A micro three-dimensional shell resonator gyroscope includes a packaging shell cover, a micro shell resonator, and a composite structure substrate. The micro shell resonator includes a shell, a single-ended column, and a flange. The composite structure substrate includes a non-planar electrode, a conductive structure, an electrical isolation part, and a main body part. The non-planar electrode includes a driving electrode, a detection circuit, an annular exciting electrode, and an isolation electrode.

Micro three-dimensional shell resonator gyroscope

A wafer-level manufacturing method for embedding a passive element in a glass substrate is disclosed. A highly-doped silicon wafer is dry etched to form a highly-doped silicon mold wafer, containing highly-doped silicon passive component structures mold seated in cavity arrays; a glass wafer is anodically bonded to the highly-doped silicon mold wafer in vacuum pressure to seal the cavity arrays; the bonded wafers are heated so that the glass melts and fills gaps in the cavity arrays, annealing and cooling are performed, and a reflowed wafer is formed; the upper glass substrate of the reflowed wafer is grinded and polished to expose the highly-doped silicon passives; the passive component structure mold embedded in the glass substrate is fully etched; the blind holes formed in the glass substrates after the passive component structure mold has been etched is filled with copper by electroplating; the highly-doped silicon substrate and unetched silicon between the cavity arrays are etched, and several glass substrates embedded with a passive element are obtained; to form electrodes for the passives, a metal adhesion layer is deposited, and a metal conductive layer is electroplated. The process is simple, costs are low, and the prepared passive elements have superior performance.

Wafer-level manufacturing method for embedding passive element in glass substrate

A foaming process for preparing wafer-level glass micro-cavities that include, etching silicon trenches on a Si wafer through Si micro-machining process; placing high-temperature outgassing agent in the silicon trenches; bonding the Si wafer with a piece of glass wafer by anodic bonding to form sealing cavities; heating up the bonded wafer, and holding the temperature the high-temperature outgassing agent such that the molten glass corresponding to the sealing cavities deforms and structures corresponding to the silicon trenches are formed in the glass; cooling down to obtain wafer-level glass micro-flow channels.

Growing community of inventors

Jiangsu, China

Jintang Shang