Samsung Sdi Co., Inc.

Jintae Hong

Jaeuk Ryu

Woonseong Baek

Inkyu Park

A core pack manufacturing apparatus for preventing or substantially preventing an iron from contacting a cell or a protective circuit part in a process of soldering a connection tab of the cell to a connection terminal of the protective circuit part. A core pack manufacturing apparatus for soldering a connection tab connected to a cell to a connection terminal of a protective circuit part includes a cap including a first cover configured to cover the cell, and a second cover extending from a side of the first cover and configured to cover the protective circuit part, the second cover having an opening part configured to expose the connection tab and the connection terminal through the second cover for soldering.

Core pack manufacturing apparatus

A battery pack and a method for fabricating the same are provided. The battery pack includes a plurality of battery cells connected in series or in parallel to each other, a protective circuit module (PCM) controlling charging and discharging of the plurality of battery cells, and a coverlay electrically connecting the plurality of battery cells to the PCM, wherein the coverlay includes a plurality of wires, each of the plurality of wires includes battery connecting pads provided at its one end, the battery connecting pads connected to the battery cells, and module connecting pads provided at it's the other end, the module connecting pads connected to the PCM, and a solder layer is formed on the battery connecting pads.

Battery pack

The present invention relates to a secondary battery, and in particular relating to a secondary battery in which connection between the bare cell and the protection circuit can be established by a mechanical connection system without using molding method. A secondary battery of the present invention includes a bare cell in which charging and discharging can be performed, a protection circuit substrate electrically connected to the bare cell, a substrate molding body integrally formed with the protection circuit substrate, a support member having a connection unit coupled to the substrate molding body for connecting the substrate molding body to the support member, and a connection member for connecting the substrate molding body to the connection unit.

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Yongin-si, South Korea

Jintae Hong