Samsung Electronics Co., Ltd.

Jinsung Jung

Youngseok Jung

Mi-Jeong Yang

Min-Soo Shim

A method of picking up a die may include classifying a pickup region of a diced wafer, in which targeted pickup dies are placed, into first to n-th regions and performing a pickup step on dies in the first to n-th regions. The first region may include first dies, which are outermost dies of the targeted pickup dies. An (x+1)-th region may include regions, occupied by dies adjacent to at least one of x-th dies in an x-th region and proximate to a center of the pickup region in relation to the x-th region, n may be a natural number, and x may be an arbitrary natural number that is smaller than the n. The n-th region may have a rectangular shape, and a quantity of n-th dies in the n-th region in contact with a short side of the n-th region may be one or two.

Method of picking up die and method of manufacturing semiconductor package using the same

A nonvolatile memory device is provided. The nonvolatile memory device includes a memory cell array comprising a first area that stores memory management information and a second area that stores user data, a decoder configured to select at least one of rows of the first area or the second area based on an address, a page buffer configured to store data in memory cells connected to the selected at least one row or to detect data stored in the memory cells, and control logic configured to control the decoder and the page buffer in response to a specific command, to access the first area. The memory management information is iteratively programmed by a specific memory unit and is written at different columns of specific memory units.

Growing community of inventors

Asan-si, South Korea

Jinsung Jung