Boe Technology Group Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Jinsan Park

Xiangdan Dong

Young Yik Ko

Wanli Dong

Benlian Wang

Haijun Qiu

Youngyik Ko

Wenbao Gao

Guobo Yang

Tingliang Liu

Lujiang Huangfu

Fengli Ji

Hongwei Ma

Yidan Zhu

Tairong Kim

Joohyeon Lee

Provided by the present disclosure are a mask assembly and a manufacturing method thereof. In the mask assembly, a plurality of connecting posts are arranged at intervals on an outer periphery of a body of a metal plate, and a plurality of grooves matched with the connecting posts are arranged on a metal frame.

Mask assembly and manufacturing method thereof

The present application provides a method of bonding an integrated circuit chip to a display panel. The method includes forming a plurality of first bonding pads in a bonding region on a first side of the display panel; forming a plurality of vias extending through the display panel in the bonding region; subsequent to forming the plurality of vias, disposing an integrated circuit chip having a plurality of second bonding pads on a second side of the display panel substantially opposite to the first side, the plurality of second bonding pads being on a side of the integrated circuit chip proximal to the display panel; and electrically connecting the plurality of first bonding pads respectively with the plurality of second bonding pads by forming a plurality of connectors respectively in the plurality of vias.

Method of bonding integrated circuit chip to display panel, and display apparatus

An OLED display substrate, a manufacturing method thereof, a packaging structure and a display device are provided. The OLED display substrate includes a display region, a barrier structure arranged at a periphery of the OLED display substrate, and a cathode lapping region arranged between the display region and the barrier structure. The OLED display substrate has an uneven surface at the cathode lapping region.

Organic light-emitting diode display substrate, manufacturing method thereof, packaging structure and display device

A display panel includes a display substrate, a chip-on-film provided at a bezel away from a display face of the display substrate, an insulation adhesive filled between the display substrate and the chip-on-film, and an integrated circuit chip fixed at a side of the chip-on-film away from the display substrate, the chip-on-film is fixed at the bezel away from the display face of the display substrate by the insulation adhesive, at the bezel there are a plurality of connection holes penetrating through the display substrate and the insulation adhesive, and conductive material filled in the respective connection holes, and signal lines at the bezel at the display face of the display substrate are connected with connection terminals provided at a side of the chip-on-film facing the display substrate via the conductive material.

Display panel, display device and method for manufacturing display panel

An array substrate and display apparatus, the array substrate comprising a base substrate () and signal lines (VDD, VSS) provided on the base substrate (), wherein at least one electrically conductive element () corresponding to the signal lines (VDD, VSS) is further provided on the base substrate (), the signal lines (VDD, VSS) are connected in parallel with corresponding electrically conductive elements (), and the electrically conductive elements () corresponding to different signal lines (VDD, VSS) are insulated from one another. Thus, resistance of the signal lines (VDD, VSS) can be reduced and the display effect can be improved.

Array substrate with a plurality of different signal lines

A display panel and a driving method thereof, and a display device are disclosed. The display panel includes: a pixel region, including a first pixel region and a second pixel region located around the first pixel region, the first pixel region and the second pixel region each including a plurality of pixels; a photosensitive layer, located at least in the second pixel region; a cover plate, on a side of the pixel region for displaying, and the cover plate including a light transmission region and a light shielding layer surrounding the light transmission region. The light shielding layer coincides with at least a portion of the second pixel region in a direction perpendicular to the cover plate, and the photosensitive layer is configured to determine a position of the light transmission region.

Display panel and driving method therefor, and display device

The disclosure discloses a display panel, a display device, and a method for manufacturing the display panel, where a chip on film is adhered on a frame edge of a side of a display substrate away from a display face of the display substrate through an insulation adhesive, and then signal lines on a frame edge of the display face of the display substrate are connected with connection terminals arranged on a side of the chip on film away from the display substrate through an electrically conductive material in a plurality of connection holes running through the display substrate, the insulation adhesive and the chip on film, so a pad bending process can be dispensed with, and there will be no pad bending area on the frame edge of the display panel, thus further narrowing a bezel of the display panel.

Display panel, display device, and method for manufacturing the display panel

A top-emitting organic electroluminescent display panel, a manufacturing method, and a display device. The top-emitting organic electroluminescent display panel comprises: a substrate, a layer of white organic light emitting diodes and a thin film encapsulation layer arranged on the substrate in sequence. The thin film encapsulation layer comprises at least two inorganic thin film layers and at least one organic thin film layer. At least one organic thin film layer is a color filter layer, the color filter layer being arranged between the at least two inorganic thin film layers. Since one of the organic thin film layers in the thin film encapsulation layer is a color filter layer, the color filter layer does not have to be arranged above the thin film encapsulation layer separately, thus reducing the number of film layers, simplifying the film layer structure, reducing manufacturing costs, and improving the luminous efficiency and the display effect.

Growing community of inventors

Beijing, China

Jinsan Park