Boe Technology Group Co., Ltd.

Boe Mled Technology Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Display Technology Co., Ltd.

China Waterborne Transport Research Institute

Beijing Boe Technology Development Co., Ltd.

Jinpeng Li

Pei Li

Pengjun Cao

Haiwei Sun

Ming Zhai

Zhiyuan Wang

Jian Li

Teng Zhang

Zongying Shu

Lu Yu

Zhiyong Chen

Pei Qin

Jian Sang

Yutao Hao

Zhihui Zeng

Kangle Chang

Xiangyu Ji

Yue Li

Shuo Wang

Dan Li

Wei Gong

Yali Zhang

Shubai Zhang

Chiachiang Lin

Zijian Wang

Yuanda Lu

Enkai Dong

Linxia Qi

Chunling Liu

Zewen Gao

Bing Qiao

Mingbo Chen

Xuan Wu

Xueyuan Ji

Shiyue Wang

Lingyun Shi

Jing Li

Ming Jin Chen

Ying Li

Zhiqiang Wang

Guangquan Wang

Junjie Ma

Hao Zhou

Shipeng Wang

Yinwei Chen

Jie Gao

Heling Zhu

Zhonghua Li

Yiping Ruan

Donglei Li

Honghao Yu

Jiaxin Li

Shanwei Yang

Yongqiang Jiang

Zhijun Xiong

Jiawei Zhao

Chenchang Chen

Jingran Niu

The present disclosure provides a backplane, including: a transparent substrate; an electrode layer provided on a side of the transparent substrate and including a plurality of signal transmission lines; a plurality of micro-display light emitting devices provided on a side, facing away from the transparent substrate, of the electrode layer, electrically coupled to the signal transmission lines, and capable of emitting light towards the transparent substrate; a protective layer provided on a side, facing away from the transparent substrate, of the micro-display light emitting devices; and a driving module provided on a side, facing away the transparent substrate, of the protective layer and electrically coupled to the signal transmission lines. The present disclosure also provides a display substrate and a display device.

Backplane, display substrate and display device

A display substrate includes a first base, a plurality of light-emitting devices disposed on a side of the first base, a light dimming layer located in gaps between the plurality of light-emitting devices and located on surfaces of the plurality of light-emitting devices away from the first base, and a second base covering the light dimming layer. The plurality of light-emitting devices are spaced apart from each other. At least one light-emitting device is surrounded by the light dimming layer, a material of a portion, located in the gaps between the plurality of light-emitting devices, of the light dimming layer includes a light absorbing material, and the light dimming layer is configured to absorb part of light entering the light dimming layer.

Display substrate and method for manufacturing the same, and display apparatus

A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Backplane and method for manufacturing the same, and display device

A display substrate includes a substrate, light-emitting devices disposed on a side of the substrate, a first light dimming layer disposed on the side of the substrate, and a first fixing layer disposed on a side of the light-emitting devices and the first light dimming layer away from the substrate. The light-emitting devices are arranged at intervals from each other and divided into a plurality of groups of light-emitting devices, and each group of light-emitting devices includes at least one light-emitting device. The first light dimming layer includes portions each located between two adjacent groups of light-emitting devices, and a gap exists between a portion of the first light dimming layer and at least one side face of at least one light-emitting device adjacent thereto. A portion of the first fixing layer is located in the gap. The first fixing layer is a light-transmitting film.

A light-emitting substrate includes a substrate and a plurality of light-emitting assemblies. The plurality of light-emitting assemblies are located on a side of the substrate. At least one light-emitting assembly includes a light-emitting element and a light adjustment portion arranged around the light-emitting element. The light adjustment portion includes a plurality of sub-structures spaced apart from each other. In any two sub-structures in the light adjustment portion in any direction away from the light-emitting element, a height of a sub-structure closer to the light-emitting element is less than a height of a sub-structure farther from the light-emitting element.

Light-emitting substrate, light-emitting module and display device

A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Light-emitting chip and light-emitting substrate

An array substrate, a method of manufacturing the array substrate, and a display device are provided. The array substrate includes: a transparent rigid base; light-emitting chips on the transparent rigid base, each light-emitting chip including a chip body and a pin coupled to the chip body, a light-exiting surface of the chip body facing towards the transparent rigid base, and the pin being on a side of the chip body facing away from the transparent rigid base; a driving wire layer on a side of the pin facing away from the transparent rigid base; and a driving chip structure on a side of the driving wire layer facing away from the transparent rigid base. The driving chip structure is coupled to pins of the plurality of light-emitting chips through the driving wire layer, and is used for provide driving signals for the light-emitting chips.

Array substrate, method of manufacturing the same, and display device

A display substrate includes a base, a plurality of light-emitting devices disposed on a side of the base, and a light adjustment layer. The plurality of light-emitting devices are spaced apart from each other. At least part of the light adjustment layer is located in gaps among the plurality of light-emitting devices, so that side walls of at least one of the plurality of light-emitting devices are surrounded by the light adjustment layer. A material of the light adjustment layer includes a light-absorbing material. The light adjustment layer is configured to absorb light incident on the light adjustment layer.

Display substrate and method of manufacturing the same, and display device

A backplane includes: a substrate including a circuit structure layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in one of the plurality of through holes. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

The present invention relates to a method for tracking, monitoring and evaluating ecological impacts of a channel project based on long-term time series satellite remote sensing data, belonging to the field of ecological environment protection. Created in view of limitations and deficiencies of existing monitoring and evaluation methods, the method includes: a process for long-term time series satellite remote sensing analysis of an ecological impact of a channel project, an analysis method for respectively evaluating erosion and deposition, shoreline and water area morphological changes at different research scales based on water body information extraction, and an analysis method for respectively tracking and monitoring engineering construction details, comparing engineering impact scope consistency and evaluating engineering implementation effects based on channel project identification.

Method for tracking, monitoring and evaluating ecological impact of channel project based on long-term time series satellite remote sensing data

The present disclosure provides a camera module mounted in a display device, comprising: a lighting lens configured to collect light; a photoelectric sensor configured to convert the light collected by the lighting lens into a corresponding electrical signal; and a reflector arranged to be capable of reflecting the light from the lighting lens towards the photoelectric sensor.

Camera module with a reflector mounted in a display device

The present invention relates to a method for evaluating an ecological environmental impact of a channel project and countermeasures thereof based on mechanism analysis, belonging to the field of ecological environmental impact evaluation technologies. In view of limitations of an existing evaluation method and the void of related technologies, the method includes: a project construction verification and change analysis method, a method for analyzing a fine classification impact mechanism and countermeasures thereof, a method for establishing a multi-level comprehensive index system of ecological environmental impacts, a method for establishing a compliance evaluation index system of an ecological channel, a method for tracking, monitoring and evaluation based on long-term time series satellite remote sensing and a method for analyzing and evaluating a superimposed and cumulative impact model.

Method for evaluating ecological environmental impact of channel project and countermeasures thereof based on mechanism analysis

The present disclosure provides a LED display device, which includes: a LED display substrate and a driving substrate opposite to each other, the LED display substrate includes: a base and a plurality of LED chips located on a side of the base distal to the driving substrate; the driving substrate includes: a PCB and a driving control element located on the PCB, and the driving control element is electrically coupled to the LED chips through a plurality of first signal wires for providing driving signals for the LED chips.

LED display device

Disclosed are a backlight module and a display device. The backlight module includes: a substrate and light emitting devices disposed on a side of the substrate, where each of the light emitting devices includes a light emitting diode, and a first connecting weld leg and a second connecting weld leg disposed between the light emitting diode and the substrate; the backlight module further includes a reflective layer between the substrate and the light emitting diodes; and for a same light emitting device, an orthographic projection of the reflective layer on the substrate and an area between orthographic projections of the first connecting weld leg and the second connecting weld leg on the substrate have an overlapping area.

Backlight module and display device

A display device and a method for manufacturing the display device are provided. The display device includes: a display panel, including a first substrate and a second substrate arranged opposite to the first substrate, wherein the first substrate includes a single-substrate area beyond the second substrate; a display driving circuit electrically connected to the display panel; a lens assembly arranged at the single-substrate area of the first substrate and configured to collect light information; and an image sensor arranged at the single-substrate area of the first substrate, connected to the display driving circuit, and configured to receive the light information collected by the lens assembly.

Display device and manufacturing method of the same

Growing community of inventors

Beijing, China

Jinpeng Li