Inopla Inc.

Alink M, Inc.

Jino Park

David Eric Berkstresser

In-kwon Jeong

Jerry J Berkstresser

A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconductor wafer onto the outer flexible membrane when suction is applied to the at least one depression.

Polishing head for polishing semiconductor wafers

A controller for a photoresist dispense pump is described that actively monitors the operation of the pump and dynamically determines completion of the refill of the pump. In one embodiment, pressure measurements are made during the refill step. Changes in the pressure measurements are used to indicate completion of the refill. After refill is completed, the refill step is terminated and the operation cycle is continued.

Growing community of inventors

San Jose, CA, United States of America

Jino Park