Industrial Technology Research Institute

Jinn-Shing King

Shur-Fen Liu

Charng-Shing Lu

Jing-Pin Pan

Jeng-Yu Tsai

Meng-Huei Chen

Jhy-Long Jeng

Min-Lin Lee

Shu-Chu Shih

Cheng-Ta Ko

Yu-Hua Chen

Tsung-Hsiung Wang

Chin-Sun Shyu

Wei-Chung Lo

Shinn-Juh Lai

Steve Lien-Chung Hsu

Li-Ming Chang

Lee-Ching Kuo

Jyh-Long Jeng

Chin-Ching Lin

Wen-Ching Sun

Yu-Chun Chen

Bih-Yih Chen

Si-Yi Chin

Tsai-An Yu

Yi-Kai Chang

Po-I Lee

Han-Lung Chen

Wen-Yueh Hsu

Yu-Tai Tsai

A polyimide copolymer represented by formula (I) or formula (II) is provided.  In formula (I) or formula (II), B is a cycloaliphatic group or aromatic group, A is an aromatic group, R is hydrogen or phenyl, and m and n are 20-50. The invention also provides a method for fabricating a patterned metal oxide layer.

Polyimide copolymers and method for fabricating patterned metal oxide layers

Additives of a polyamic acid resin composition are disclosed, including an ester-phenol compound, an imidazole compound, and a heterocyclic aromatic amine compound other than the imidazole compound. The high cyclization temperature and long cyclization period of conventional polyamic acid resin compositions can be lowered and shorten by the additives of the invention. In addition, a metal foil and the polyimide resin formed from the cyclization have excellent adhesive strength, high flat degree, and excellent electrical property.

Polyamic acid resin composition and method for forming polyimide resin

The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m&#xb7;K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m&#xb7;K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m&#xb7;K and a breakdown voltage greater than about 3KV.

Polyimide film laminate and metal laminate employing the same

A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of Rand R, independently, is a Csaturated or an unsaturated carbon chain, Ris ether, phenyl, a Cheterocyclic or Csaturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

Thermally curable solder resist composition

A plurality of coaxial leads is made within a single via in a circuit substrate to enhance the density of vertical interconnection so as to match the demand for higher density multi-layers circuit interconnection between top circuit layer and bottom circuit layer of the substrate. Coaxial leads provide electromagnetic interference shielding among the plurality of coaxial leads in a single via.

Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof

The invention discloses double-sided metal clad laminates and fabrication methods thereof. A plurality of polyamic acid coatings is co-extruded on a first metal foil and heat imidization to provide a multilayer polyimide film. A second metal foil is hot pressed on the multilayer polyimide film, thus providing a double-sided metal clad laminate. The polyamic acid coatings include a first, a second, and a third polyamic acid coating with surface tensions of S1, S2, and S3, respectively, satisfying relations of S1&#x3e;S2&#x3e;S3, wherein the first polyamic acid coating is the coating directly applied on the first metal foil.

Double-sided metal clad laminate and fabrication method thereof

A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Arrepresents a bivalent aromatic group, and Arrepresents a bivalent aromatic group containing an OH or COOH group. 

Thermoplastic polyimide composition

The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C&#x2550;C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.

Negative photoresist composition

The present invention discloses an organic-inorganic hybrid composition with sufficient flexibility, a high dielectric constant, which can be used as a bonding layer having a high thermal stability and high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) an electrically conductive powder, such as an electrically conductive carbon black; d) at least one macromolecular flexibilizer; e) a macromolecular dispersant; and f) additives such as a diluent, an adhesive promoter, a hardener, a hardener promoter, and an organic solvent.

Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof

An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

Structure of an interleaving striped capacitor substrate

The present invention discloses an organic-inorganic hybrid composition with a high dielectric constant, which can be used as a bonding layer having a high thermal stability and a high dielectric constant. The composition includes a) a high Tg epoxy resin system; b) ferroelectric ceramic particles having two particle size distributions, with one of them pertaining to a nano level; c) at least one macromolecular flexibilizer; d) a macromolecular dispersant; and e) additives such as a diluent, an adhesive promoter, a catalyst, and an organic solvent.

Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof

A resin composition useful in the fabrication of circuit boards comprises (i) 1&tilde;15 W % of bismaleimide modified by barbituric acid (BTA) and its derivatives; and (ii) 20&tilde;50 wt % of polyphenylene ether (PPE) chain-broken in a phenol resin; wherein the phenol resin is terpene phenol resin or dicyclopentadiene phenol resin. Other additives, such as curing agent, catalyst or inorganic particle additive can be added as well, based on requirements. According to the invention, terpene novolac resin and initiator (peroxide) are added in polyphenylene ether so that molecules are rearranged to form a PPE resin having lower molecular weight and higher crosslinking density. Furthermore, BMI/epoxy resin/PPE are combined in different weight percentages. Semi-interpenetrating polymer network structures are thus formed. Consequently, T and resistances both to heat and solvent of the resin are increased.

Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin

The present invention relates to a positive-working photosensitive composition comprising a partially diazonaphthoquinone (DNQ) capped polyamic ester with a capping level of about 5-80 molar %; a photosensitive agent and a solvent. The composition shows a high photosensitivity and leaves a relief pattern with high resolution and low dark film loss.

Positive working photosensitive composition, article and process for forming a relief pattern

An adhesive tape for lead-on-chip (LOC) IC applications containing a polyamide-based adhesive composition which is the reaction product from a reaction mixture of: (a) a pre-imidized polyamic acid; and (b) a bismaleimide that has been modified by a barbituric acid of a derivative of barbituric acid to become a barbituric acid modified bismaleimide. The pre-imidized polyamic acid is a reaction product from a reaction mixture that contains a polyamic acid and a cyclizing agent. The polyamide-based adhesive composition provides all the desirable heat resistance and other mechanical and dielectric characteristics. But, most significantly, its microscopic rheological properties are adjusted such that excellent contact is achieved between the resin molecules and the lead frame surface while eliminating or at least minimizing the extent of adhesive overflow, which can substantially reduce the reliability of the final IC product.

Polyimide composition for LOC adhesive tapes

The present method provides a method for preparing the PI varnish which has the steps of: 1) preparing a mixed solution of 60-100% by weight aprotic solvent, and 0-40% by weight aromatic solvent; 2) adding into the mixed solution in a mole ratio of 1:9 two aromatic diamines; and 3) further adding in the mixed solution in a mole ratio of 1:5 two aromatic dianhydrides. Such PI has a suitable thermal expansion coefficient and characteristics different form those of the PI currently in use.

Growing community of inventors

Hsinchu, Taiwan

Jinn-Shing King