Lumens Co., Ltd.

Robert Boschgmbh

Samsung Sdi Co., Inc.

Jinmo Kim

Younghwan Shin

Jimin Her

Sol Han

Kyujin Lee

Jinwon Choi

Daewon Kim

Taekyung Yoo

Sangwon Byun

Junhyung Lim

Seokyoon Yoo

Sungbae Kim

Kyoungsoo Kim

Seongbok Yoon

Keunoh Kim

Huikyeong Noh

Yonghae Kang

An LED display module is disclosed. The LED display module includes: an active matrix substrate including a plurality of control units; a plurality of pairs of solder bumps arranged in a matrix on the active matrix substrate by transfer printing; a plurality of LED chips including pairs of electrodes connected to the corresponding plurality of pairs of solder bumps and arranged in a matrix on the active matrix substrate by transfer printing; grid barriers formed on the active matrix substrate to isolate the plurality of LED chips into individual chip units; and a multi-color cell layer including a plurality of color cells and aligned with the active matrix substrate such that the plurality of color cells match the plurality of LED chips in a one-to-one relationship. The plurality of color cells include first color cells, second color cells, and third color cells disposed consecutively in one direction.

LED display modules and methods for making the same

Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

LED module and method for fabricating the same

Method for fabricating LED module using transfer tape

An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.

LED display module

LED Module and method for fabricating the same

A secondary battery includes an electrode assembly having a first electrode, a second electrode, and a separator located between the first electrode and the second electrode; a first collector plate electrically coupled to the first electrode; a case housing the electrode assembly and the first collector plate and having an opening; a cap assembly sealing the opening of the case and being electrically coupled to the first collector plate; a first electrode terminal comprising a first electrode terminal plate electrically coupled to the cap assembly; and a second electrode terminal protruding through the cap assembly, electrically coupled to the second electrode and electrically insulated from the cap assembly.

Secondary battery and method for fabricating the same

Growing community of inventors

Yongin-si, South Korea

Jinmo Kim