Intel Corporation

Jinlin Wang

James Chris Matayabas, Jr

Paul A Koning

Daewoong Suh

Carl L Deppisch

Nirupama Chakrapani

Shripad Gokhale

Abhishek Gupta

Gopalakrishnan Subramanian

Larry DeCesare

Jason Murphy

Mike Boyd

Brad Drew

Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.

Methods of fabricating robust integrated heat spreader designs and structures formed thereby

Methods and apparatus to control surface properties via colloidal coatings are described. In one embodiment, colloidal coating may be used on a surface to enhance flow control. Other embodiments are also described.

Controlling substrate surface properties via colloidal coatings

An electronic package includes a heat-generating electronic component such as an integrated circuit chip, a thermally conductive member, which may be an integrated heat spreader, and a low modulus thermal interface material in heat conducting relation between the electronic component and the thermally conductive member. Increased thermal performance requirements at the electronic component level are met by the thermal interface material, which includes a polymer matrix and thermally conductive filler, which has a storage shear modulus (G&prime;) at 125&deg; C. of less than about 100 kPa, and which has a gel point, as indicated by a value of G&prime;/G&Prime; of &gE;1, where G&Prime; is the loss shear modulus of the thermal interface material. The values for G&prime; and G&Prime; are measured by a strain-controlled rheometer.

Electronic packages having good reliability comprising low modulus thermal interface materials

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Chandler, AZ, United States of America

Jinlin Wang