Seoul National University

Jinhyun Kim

Jungsuek Oh

This transmission line for a millimeter wave band using a vertical type PIN diode comprises: a diode layer comprising a vertical type PIN diode and a metal column of the same size as the vertical type PIN diode; an upper signal application substrate which is located on the diode layer and comprises metal columns for transferring a millimeter wave signal to the diode layer; a lower signal application substrate located under the diode layer; an upper bonding film for connecting the diode layer to the upper signal application substrate; and a lower bonding film for connecting the diode layer to the upper signal application substrate. By applying a vertical type PIN diode which is very small in size compared to SMD type diodes of existing types and may be mounted within an intermediate substrate, the freedom in designing an antenna and a circuit may be significantly improved.

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Seoul, South Korea

Jinhyun Kim