Samsung Electronics Co., Ltd.

Jinhyuk Choi

Beomsoo Hwang

Kongwoo Lee

Kyusang Lee

Myungki Song

Yonghwan Hyun

Sengtai Lee

Jonghwi Seo

Seho Shin

ByeongJu Lee

Sung Hyun Chung

Keonwoo Kim

Dae Hyun Ji

Yonghyun Park

Tae Soo Kim

Jisu Ryu

Duckjin Kim

Seojoo Choi

Hyunjoo Jeon

Daejin Kwak

Hyunwoong Choi

A semiconductor processing device includes a stage configured to receive a bare wafer placed thereon, a laser sensor located above the stage in a vertical direction, orthogonal to an upper surface of the bare wafer, a camera sensor located above the stage in a first direction, a lighting device radiating an imaging region imaged by camera sensor with light, and a controller, configured to rotate the bare wafer using the stage, obtain a plurality of sub-images of the bare wafer captured by the camera sensor to generate an original image of the bare ware, and detect a first defect of the bare wafer using the original image, wherein the controller is configured to detect a second defect of the bare wafer by measuring a distance between the laser sensor and the bare wafer, while rotating the bare wafer using the stage.

Semiconductor processing device and semiconductor processing system

Provided is a method and apparatus with driving control. A method includes estimating a predicted route of a vehicle based on odometry information of the vehicle and location information of the vehicle, based on road map information, determining a target zone corresponding to the predicted route, and generating driving control information of the vehicle based on an object detection result for the determined target zone.

Method and apparatus with driving control

A semiconductor substrate processing apparatus includes a substrate transfer module including a chamber having an internal space extending in a first direction within the chamber, at least one pair of first load ports at opposite sides of the chamber, to face in a second direction intersecting the first direction, and configured to rotate and move a substrate carrier, a load lock at a rear surface of the chamber, and a robot arm configured to move in the first direction in the internal space of the chamber, a transfer chamber connected to the load lock of the substrate transfer module, a plurality of processing chambers connected to the transfer chamber, and a transfer arm inside the transfer chamber, and configured to unload the semiconductor substrate from the load lock and to load the semiconductor substrate into at least one of the plurality of processing chambers.

Semiconductor substrate processing apparatus

Disclosed is an apparatus and method with object detection. The method may include updating a pre-trained model based on sensing data of an image sensor, performing pseudo labeling using an interim model provided a respective training set, determining plural confidence thresholds based on an evaluation of the interim model, performing multiple trainings using the interim model and the generated pseudo labeled data, by applying the determined plural confidence thresholds to the multiple trainings, respectively, and generating an object detection model dependent on the performance of the multiple trainings, including generating an initial candidate object detection model when the interim model is the updated model.

Apparatus and method with object detection

A loadlock apparatus includes a loadlock chamber including a first opening and a second opening separated in a vertical direction; a first slit valve including a first valve plate configured to move between a first open position where the first opening is open and a first closed position where the first opening is closed, the first open position being a position moved downward from the first closed position; and a second slit valve including a second valve plate configured to move between a second open position where the second opening is open and a second closed position where the second opening is closed, the second open position being a position moved upward from the second closed position.

Loadlock apparatus and substrate processing apparatus including the same

A wafer transfer apparatus includes a controller, a wafer transfer robot including a hand unit configured to hold a wafer, a driving unit connected to the hand unit and configured to move the wafer, and a sensor unit provided on the driving unit, and a plurality of transfer structures configured to exchange the wafer with the wafer transfer robot, each of the plurality of transfer structures including a plurality of markers recognizable by the sensor unit, where the sensor unit includes a camera sensor recognizing the plurality of markers and a laser sensor configured to measure distances to the plurality of markers by emitting a laser to the plurality of markers and receiving the laser reflected from the plurality of markers.

Wafer transfer apparatus with aligner

A wafer processing apparatus may include a plurality of equipment front end modules (EFEMs), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. Each of the plurality of EFEMs may include an EFEM chamber, a plurality of load ports provided at a side of the EFEM chamber, and a load lock provided at a side of the EFEM chamber to overlap with at least one of the plurality of load ports in a vertical direction.

Wafer processing apparatus including EFEM and method of processing wafer

A method with vanishing point estimation includes: obtaining an image of a current time point of objects comprising a target vehicle; detecting the objects in the image of the current time point; tracking positions of the objects in a world coordinate system by associating the objects with current position coordinates of the objects determined from images of previous time points that precede the current time point; determining a vanishing point for each of the objects based on the positions of the objects; and outputting the vanishing point determined for each of the objects.

Method and apparatus with vanishing point estimation

Various embodiments of the present invention relate to an electronic device for diagnosing a battery, and the electronic device may include a battery; and a power management module operatively connected with the battery, and including a charging circuit which controls charge of the battery, wherein the power management module is configured to monitor a charge state of the battery, if the battery reaches a first designated state, identify a time taken to change from the first designated state to a second designated state, and determine whether the battery is abnormal, based at least in part on the identified time. Other various embodiments are possible.

Electronic device and method for diagnosing battery thereof

According to various embodiments of the present invention, an electronic device may comprise a battery, a power management module, and a processor. The processor may be configured to: acquire power for battery charging from a source outside the electronic device through the power management module, charge the battery at a designated current value by using the power, check charging state information based on charging time and battery capacity according to charging in a designated charging state measurement interval after the charging is started, and when the charging state information satisfies a given condition, perform a designated operation associated with the battery. Various other embodiments are also possible.

Device and method for controlling charging on basis of battery charging or discharging time

A wafer processing apparatus of an embodiment of the present disclosure may include an equipment front end module (EFEM), a wafer transfer chamber, a wafer processing chamber, and a wafer transfer arm. In addition, the EFEM may include an atmosphere control chamber configured to store a wafer carrier accommodating wafers, an upper air supplier configured to supply air into the atmosphere control chamber, an EFEM chamber under the atmosphere control chamber, a load lock arranged to be vertically overlapped by at least a portion of the EFEM chamber, and an EFEM arm configured to transfer the wafer carrier.

Wafer processing apparatus including equipment front end module (EFEM) and wafer processing method using the same

An electronic device, to detect an object, may continuously obtain a driving image and convert the driving image into a top-view image, generate a change value including a horizontal change value based on a steering angle and a vertical change value based on a vehicle speed, compensate the top-view image based on a plurality of lanes to generate first data and compensate the first data based on the change value to generate second data, generate third data based on performing a subtraction operation on a first frame and a second frame of the second data, and a group the third data and extract a grouped object.

Processors configured to detect objects and methods of detecting objects

Vanishing point extraction includes obtaining a straight line including a vanishing point of a first image; obtaining a plurality of sample points in the first image based on processing the first image according to an object included in the first image and the straight line including the vanishing point of a first image, such that the plurality of sample points are determined as pixels in the first image having coordinates that overlap with coordinates of pixels of both the straight line and the object included in the first image; obtaining at least one matching point, in a second image, that corresponds to at least one sample point of the plurality of sample points in the first image the second image generated subsequently to the first image being generated; and obtaining a vanishing point of the second image based on the at least one matching point of the second image.

Growing community of inventors

Suwon-si, South Korea

Jinhyuk Choi