Samsung Electronics Co., Ltd.

Jinhoon Jang

Kyungryun Kim

Changkyo Lee

Kyungsoo Ha

Kiseok Oh

Dongkeon Lee

Kijun Lee

Myungkyu Lee

Sunghye Cho

Sungrae Kim

Yeonggeol Song

Yeonkyu Choi

Youngbin Lee

Kiho Kim

Isak Hwang

A semiconductor memory device includes a memory cell array and a plurality of data input/output (I/O) pins. The plurality of data I/O pins is configured to receive write data to be stored in the memory cell array or to output read data stored in the memory cell array. The semiconductor memory device is configured to perform a burst operation in which a single data set comprising a plurality of data bits is input or output through the plurality of data I/O pins based on a single command received from an external memory controller. A number of the plurality of data I/O pins corresponds to an integer that is not a power-of-two. A burst length representing a unit of the burst operation corresponds to an integer that is not a power-of-two.

Semiconductor memory devices that perform burst operations

A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.

Apparatus for transmitting and receiving a signal, a method of operating the same, a memory device, and a method of operating the memory device

A semiconductor memory device includes a memory cell array, a link error correction code (ECC) engine and on-die ECC engine. The memory cell array includes a plurality of volatile memory cells. The link ECC engine provides a main data by performing a first ECC decoding on a first codeword including the main data and a first parity data, and generates a first error flag based on a result of the first ECC decoding. The on-die ECC engine generates a second parity data by performing a first ECC encoding on the main data, provides a target page of the memory cell array with a second codeword including the main data and the second parity data in response to the first error flag being deactivated or generates a third codeword by changing at least one of bits of the second codeword in response to the first error flag being deactivated.

Semiconductor memory devices

Provided are an apparatus, a memory device, and a method for storing a plurality of parameter codes for an operation parameter. The memory device includes a mode register and a control logic circuit. To set a first operating condition and a second operating condition for one operation parameter, the mode register stores a first parameter code for the operation parameter and a second parameter code, which is expressed as an offset value from the first parameter code. The control logic circuit sets the first operating condition as a current operating condition of the memory device by using the first parameter code based on a first control code and sets the second operating condition as the current operating condition of the memory device by using the first parameter code and the second parameter code based on a second control code.

Apparatus, memory device, and method for storing multiple parameter codes for operation parameters

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Suwon-si, South Korea

Jinhoon Jang