Electronics and Telecommunications Research Institute

Lg Chem, Ltd

Other

Korea Advanced Institute of Science and Technology

University-Industry Cooperation Group of Kyung Hee University

Kwangwoon University Industry-Academic Collaboration Foundation

Jinho Lee

Hui Yong Kim

Jin Soo Choi

Se Yoon Jeong

Jin Woo Hong

Sung-Chang Lim

Hae-Chul Choi

Jongho Kim

Sukhee Cho

Hahyun Lee

Jin Woong Kim

Chan Hyo Park

Hye Won Jeong

Kyungjun Kim

Bora Shin

Hangah Park

Kyoung Hoon Kim

MiRa Im

Seung Yup Lee

Jinyoung Park

Chae Won Park

Gwang Hoon Park

Jung Ho Jo

Mun Churl Kim

Seoung-Jun Oh

Dong-Gyu Sim

Cheolmin Yun

Sea-Nae Park

Kyunghwan Kim

Danbi Choi

Ye Ji Hong

Neung-Joo Hwang

According to the present invention, a stack comprises, between a carrier substrate and a flexible substrate layer, a peeling power adjustment layer comprising polyimide, which has a refractive index higher than that of the flexible substrate layer, so that a flexible substrate can be more easily peeled from a carrier substrate layer, and thus a flexible element can be manufactured without damage to the element through a simpler process.

Stack for manufacturing flexible element and method for manufacturing flexible element by using same

The present invention provides a polyimide film comprising a polyimide, of which the Intvalue calculated from equation 1 is −3 or greater when the weight reduction rate measured by the thermogravimetric method (TGA) is 5%. The film according to the present invention can exhibit excellent thermal stability even in high-temperature conditions, and thus maintain excellent heat resistance and mechanical characteristics against high-temperature heat added during the display device manufacturing process. In equation 1, Ea, R, T, β, P(X), and tare the same as those defined in the detailed description.

Polyimide film for display substrate

The present invention employs a polyimide film, which has a coefficient of thermal expansion (CTE) that is a negative number at a temperature equal to or greater than 350&#xb0; C., as a debonding layer for separating a flexible substrate and a carrier substrate, and thus can easily separate a flexible substrate from a carrier substrate by using a detaching phenomenon caused by a difference in residual stress between the flexible substrate and the debonding layer after a high-temperature process for producing an element on the flexible substrate. Therefore, the present invention can separate the flexible substrate without causing chemical or physical damage to the element formed on the flexible substrate, thereby minimizing problems that may occur during a stripping process.

Laminate for manufacturing flexible display, and flexible display manufacturing method using same

Provided is an image encoding/decoding apparatus and method. The image encoding apparatus may include a motion vector prediction unit to perform a prediction with respect to an arbitrary motion vector of a current block within an image, using at least one of vector information of a motion vector corresponding to an adjacent block and vector information of a previous motion vector of the current block, and a differential determination unit to determine differential information of a motion vector of the current block based on the motion vector predicted in the motion vector prediction unit and an actual motion vector of the current block.

Image encoding/decoding apparatus and method

A polyimide film according to the present invention can be effectively used as a substrate for a flexible display device without a deterioration in heat resistance even at a temperature of 350&#xb0; C. or higher since a coefficient of thermal expansion (A) in the section of 100-350&#xb0; C., of the polyimide film, and a coefficient of thermal expansion (B) in the section of 350-450&#xb0; C., of the polyimide film, meet 0&#x3c;B/A&#x3c;2.

Polyimide film for flexible display device substrate

A method for producing a device substrate by obtaining a laminate comprising a carrier substrate with a first polyimide film disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film, applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the adhesive strength of the first polyimide to the second polyimide film decreases and separating the second polyimide film from the first polyimide film formed on the carrier substrate to obtain the device.

Laminate, and element comprising substrate manufactured using same

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

Laminite, and element comprising substrate manufactured using same

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200&#xb0; C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin having a similarity score not greater than 0.5, as calculated by Equation 1 defined in the detailed description, between a carrier substrate and a flexible substrate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

Growing community of inventors

Daejeon, South Korea

Jinho Lee