Imra America, Inc.

Rensselaer Polytechnic Institute

Other

Jingzhou Xu

Gyu Cheon Cho

Xi-Cheng Zhang

Lawrence Shah

Kai Chieh Liu

Alan Y Arai

Brian Schulkin

Thomas Tongue

Jian Chen

Tao Yuan

Yong Che

Haibin Zhang

James Bovatsek

Zhendong Hu

Bing Liu

Makoto Murakami

Fumiyo Yoshino

Shigeru Suzuki

Takashi Hori

Haewook Han

Jin Young Sohn

Makoto Yoshida

Chirped pulse amplification (CPA) systems configured to generate and amplify multi-pulses are described. The nonlinear interaction of pulses can generate a multiple pulse pack with a dense time separation between pulses. Reducing or eliminating the nonlinear interaction can be provided by spectrally and/or temporally splitting pulses in the chirped amplification system.

Multi-pulse amplification

In at least one embodiment a laser system includes a fiber laser source, a polarization controller and a wavelength converter. The relative power distribution between a pump wavelength and a signal wavelength is controllable using the polarization controller. An optional phase compensator is used to control polarization state of the output laser beam. In various embodiments the relative power distribution among multiple wavelengths may be controlled over a range of at least about 100:1.

Controllable multi-wavelength laser source

Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse width sufficiently short so that material is efficiently removed by nonlinear optical absorption from the region and a quantity of heat affected zone and thermal stress on the material within the region, proximate to the region, or both is reduced relative to a quantity obtainable using a laser with longer pulses. In at least one embodiment, an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a composite material.

Laser-based material processing apparatus and methods

In at least one embodiment time separated pulse pairs are generated, followed by amplification to increase the available peak and/or average power. The pulses are characterized by a time separation that exceeds the input pulse width and with distinct polarization states. The time and polarization discrimination allows easy extraction of the pulses after amplification. In some embodiments polarization maintaining (PM) fibers and/or amplifiers are utilized which provides a compact arrangement. At least one implementation provides for seeding of a solid state amplifier or large core fiber amplifier with time delayed, polarization split pulses, with capability for recombining the time separated pulses at an amplifier output. In various implementations suitable combinations of bulk optics and fibers may be utilized. In some implementations wavelength converted pulse trains are generated. A method and system of the present invention can be used in time domain applications utilizing multiple beam paths, for example spectroscopy.

Optical pulse source with increased peak power

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

Transparent material processing with an ultrashort pulse laser

Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

Methods and systems for laser processing of coated substrates

Methods and systems for delivery of high peak power optical pulses through optical fiber are disclosed. Raman soliton generation is utilized to maintain the properties of the pulses in the delivery fiber. The apparatus can comprise any high peak power pulse source and delivery fiber supporting Raman soliton generation.

Methods and systems for fiber delivery of high peak power

Methods and apparatus for detecting variations in electromagnetic fields, in particular, terahertz (THz) electromagnetic fields, are provided. The methods and apparatus employ polarization detection devices and controllers to maintain or vary the polarization of modulated signals as desired. The methods and apparatus are provided to characterize electromagnetic fields by directing the electromagnetic field and a probe beam upon an electro-crystal and detecting the modulation of the resulting probe beam. Detection of the modulation of the probe beam is practiced by detecting and comparing the polarization components of the modulated probe beam. Aspects of the invention may be used to analyze or detect explosives, explosive related compounds, and pharmaceuticals, among other substances. A compact apparatus, modular optical devices for use with the apparatus, sample holders, and radiation source mounts are also disclosed.

Terahertz radiation source mounting arrangements and methods of mounting a terahertz source

Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

Laser-based material processing methods and systems

A method of forming patterns on transparent substrates using a pulsed laser is disclosed. Various embodiments include an ultrashort pulsed laser, a substrate that is transparent to the laser wavelength, and a target plate. The laser beam is guided through the transparent substrate and focused on the target surface. The target material is ablated by the laser and is deposited on the opposite substrate surface. A pattern, for example a gray scale image, is formed by scanning the laser beam relative to the target. Variations of the laser beam scan speed and scan line density control the material deposition and change the optical properties of the deposited patterns, creating a visual effect of gray scale. In some embodiments patterns may be formed on a portion of a microelectronic device during a fabrication process. In some embodiments high repetition rate picoseconds and nanosecond sources are configured to produce the patterns.

Pulsed laser micro-deposition pattern formation

Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may also include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

An imaging apparatus uses focusing and collecting optics in combination with steering optics for efficient imaging of a target using an extended terahertz electro-magnetic range challenged by weak sources and low sensitivity of detection. By proper location of optics to utilize angular conversion of the beam to a lateral scan, a rastering imaging apparatus is demonstrated without moving target or entire imaging system. In at least one embodiment a mirror-lens set is used to steer the terahertz (THz) beam along and (or) to collect the THz beam from each point of the target. The target is imaged with a much higher speed than when moving the target or the entire imaging system. A THz wave image can be taken at video frequency for practical usage of the apparatus in diverse application areas, where it has not been considered to be feasible.

Beam scanning imaging method and apparatus

Systems, methods, and devices for handling terahertz radiation

A method and system for imaging an object includes transmitting distinguishable electromagnetic waves from a plurality of radiators of an antenna array, wherein each of the distinguishable electromagnetic waves is distinguishable from others by a detector. Each of the radiators transmits radiation comprising a different distinguishable electromagnetic wave. The method also includes imaging at least a portion of the antenna array onto a targeted object, wherein each image area of a plurality of image areas on the targeted object corresponds to an image of a respective radiator of the antenna array, and detecting a plurality of resultant electromagnetic waves, wherein the resultant electromagnetic waves are transmitted, scattered, or reflected by respective image areas on the targeted object in response to each of the respective image areas being illuminated by the radiation transmitted by the respective radiator of the source array.

Growing community of inventors

Ann Arbor, MI, United States of America

Jingzhou Xu