Intel Corporation

Jingyi Huang

Omkar G Karhade

Nitin A Deshpande

Wei Ey Li

Sairam Agraharam

Edvin Cetegen

Yiqun Bai

Manish Dubey

Vipul V Mehta

Bassam Mohammed Ziadeh

Xiaoqian Li

Ziyin Lin

Mohit Bhatia

Malavarayan Sankarasubramanian

Anurag Tripathi

Wei Li

Jan Krajniak

Jinhe Liu

Joseph Van Nausdle

Santosh Shaw

Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.

Barriers for grooves in photonics dies

Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.

Hydrophobic feature to control adhesive flow

Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.

Microelectronic structures including bridges

Growing community of inventors

Chandler, AZ, United States of America

Jingyi Huang