The Hong Kong University of Science and Technology

Jingshen Wu

Matthew Ming Fai Yuen

Shi-Wei Lee

Haibo Fan

Haibin Chen

Hon Shing Lau

Chi Chuen Lo

Zheming Zhang

An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects

An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers

A test apparatus applies high speed impact load to a sample to test the shear strength of attachment of a component part to the sample, by use of a rotary drive mechanism driving an impact tip. A support mechanism provides alignment between the impact tip and a portion of the sample to receive a test force, and prevents relative movement of at least one of the sample and the impact tip. The rotary drive mechanism establishes a impact force between the impact tip and the sample, and a force transducer receives the resultant force and providing a corresponding output. In one example the force transducer uses a piezoelectric film for sensing. The testing may be used, for example, to provide stable impact speed to a solder ball, and provide, as an output a force and displacement relationship curve. The stable speed can be acquired by clutch, and the data collection.

Single solder ball impact tester

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Hong Kong, China

Jingshen Wu