General Electric Company

Jingkui Shi

Stefan Schroeder

Jie Shen

Zhihui Yuan

Saijun Mao

Bo Qu

Marius Michael Mechlinski

He Xu

Rui Li

Yingqi Zhang

Lin Lan

Alistair Martin Waddell

Mark Aaron Chan Chan

Mark Aaron Chan

Stafan Schroeder

The present disclosure relates to an integrated power semiconductor packaging apparatus and a power converter containing the integrated power semiconductor packaging apparatus. The integrated power semiconductor packaging apparatus comprises a plurality of power semiconductor devices and an electrically insulative substrate formed integrally. The electrically insulative substrate comprises a flat surface, at least one separation wall protruding from the flat surface and a flow channel inside the electrically insulative substrate. The at least one separation wall is configured to separate the flat surface into a plurality of flat areas, and each of the plurality of flat areas is configured to receive one of the plurality of power semiconductor devices. The flow channel is configured for allowing a coolant flowing through to remove heat from the plurality of power semiconductor devices.

Integrated power semiconductor packaging apparatus and power converter

The present disclosure relates to a snubber circuit which comprises a static snubber unit, connected in parallel with the switch, for balancing a static voltage sharing across a switch when the switch is in a state of turn-on or turn-off; and a dynamic snubber unit for balance a dynamic voltage sharing across the switch when the switch is in a process of turn-on or turn-off, comprising a dynamic voltage sharing capacitor connected in parallel with the switch and having a relationship between a capacitance and a voltage of the dynamic voltage sharing capacitor; and a controller for controlling the capacitance of the dynamic voltage sharing capacitor to be in a predetermined working area of capacitance rising while the voltage across the switch is increasing. The present disclosure also relates to a power semiconductor device.

Power semiconductor device and snubber circuit thereof

Growing community of inventors

Shanghai, China

Jingkui Shi