Kla Tencor Corporation

Future Wei Technologies, Inc.

Nec Laboratories America, Inc.

Hamamatsu-photonics K.k.

Kla Corporation

Jingjing Zhang

Yung-Ho Alex Chuang

John Fielden

David Lee Brown

Wei Wei

Konstantinos Kanonakis

Devis Contarato

Liurong Qian

Ting Wang

Sharon Zamek

Bin-Ming Benjamin Tsai

Neda Cvijetic

Xuefeng Liu

Mark Shi Wang

Venkatraman Iyer

Marcel Trimpl

Keith Lyon

Masaharu Muramatsu

Yasuhito Yoneta

Shinya Otsuka

Jehn-Huar Chern

Naoto Maeda

Sisir Yalamanchili

Steve Zamek

Ronggang He

David L Brown

A telecommunications edge cloud (TEC) element comprising a plurality of TEC hardware components comprising a computing component that includes one or more processors, a storage component that includes a memory, a networking component, with the TEC device being deployed between a client and a packet network, the computing component being configured to manage a computing resource in the computing component, a networking resource in the networking component, and a storage resource in the storage component, allocate the computing resource for a first application of the plurality of different applications, execute the first application using the computing resource, allocate the networking resource for a second application of the plurality of different applications, execute the second application using the networking resource, allocate the storage resource for a third application of the plurality of different applications, execute the third application using the storage resource.

Modular telecommunication edge cloud system

Control plane management based on physical topology of nodes in software-defined networks (SDNs) is provided. Nodes in an SDN are organized into a plurality of node clusters. A cluster of nodes in an SDN is formed and control plane management for the nodes within the cluster is provided. A topology-aware assignment of nodes to controllers in an SDN is provided. Related nodes such as root and corresponding child nodes are assigned to a single cluster in one embodiment to lessen the impacts of controller failure. The assignment of nodes to controllers is also provided based on minimizing traffic between node clusters and between nodes and external networks.

Topology-aware controller associations in software-defined networks

An image sensor utilizes a pure boron layer and a second epitaxial layer having a p-type dopant concentration gradient to enhance sensing DUV, VUV or EUV radiation. Sensing (circuit) elements and associated metal interconnects are fabricated on an upper surface of a first epitaxial layer, then the second epitaxial layer is formed on a lower surface of the first epitaxial layer, and then a pure boron layer is formed on the second epitaxial layer. The p-type dopant concentration gradient is generated by systematically increasing a concentration of p-type dopant in the gas used during deposition/growth of the second epitaxial layer such that a lowest p-type dopant concentration of the second epitaxial layer occurs immediately adjacent to the interface with the first epitaxial layer, and such that a highest p-type dopant concentration of the second epitaxial layer occurs immediately adjacent to the interface with pure boron layer.

Back-illuminated sensor and a method of manufacturing a sensor

An image sensor for electrons or short-wavelength light includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. The circuit elements are connected by metal interconnects comprising a refractory metal. An anti-reflection or protective layer may be formed on top of the pure boron layer. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor.

A telecommunications edge cloud (TEC) element deployed between a client and a packet network includes a TEC hardware layer including storage resources, networking resources, and computing resources, wherein the computing resources include a plurality of processors. A TEC operating system (TECOS) is coupled to the TEC hardware layer and configured to control and manage the storage resources, the networking resources, and the computing resources, wherein the TECOS is executed by one of the processors, a TEC application layer coupled to the TECOS, wherein the TEC application layer is configured to process a request from the client using the TECOS, wherein the computing resources are configured to provide a service to the client when the request is a service request, and wherein at least one of the networking resources and the storage resources is configured to provide data to the client when the request comprises a data request.

A multiple-column-per-channel image CCD sensor utilizes a multiple-column-per-channel readout circuit including connected transfer gates that alternately transfer pixel data (charges) from a group of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at multiple times the line clock rate to pass the image charges to the shared output circuit. A symmetrical fork-shaped diffusion is utilized in one embodiment to merge the image charges from the group of related pixel columns. A method of driving the multiple-column-per-channel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the multiple-column-per-channel CCD sensor is also described.

Multiple column per channel CCD sensor architecture for inspection and metrology

A dual-column-parallel image CCD sensor utilizes a dual-column-parallel readout circuit including two pairs of cross-connected transfer gates to alternately transfer pixel data (charges) from a pair of adjacent pixel columns to a shared output circuit at high speed with low noise. Charges transferred along the two adjacent pixel columns at a line clock rate are alternately passed by the transfer gates to a summing gate that is operated at twice the line clock rate to pass the image charges to the shared output circuit. A symmetrical Y-shaped diffusion is utilized in one embodiment to merge the image charges from the two pixel columns. A method of driving the dual-column-parallel CCD sensor with line clock synchronization is also described. A method of inspecting a sample using the dual-column-parallel CCD sensor is also described.

Dual-column-parallel CCD sensor and inspection systems using a sensor

A network model is provided for modeling the nodes in networks such as access networks having a tree topology. Using the model, a network description can be generated that includes a node description for each node in the access network. A node description for a node includes an extra field to define child nodes relative to a modeled node. The node description also includes an extra field to describe a link from a modeled node to an upstream node. The connecting links and intermediate nodes of access nodes are exposed and can be manipulated. By providing a node description with child and link fields, a separate link data store can be avoided.

Modeling access networks as trees in software-defined network controllers

A method for performing in-band operations, administration, and management (OAM) using fixed bytes. According to one aspect, data packets are selected from a packet flow according to a sampling rate. A network device's OAM information is inserted into a fixed length field of each selected packet as a selected packet is processed by the network device.

In-band telemetry with limited extra bytes

Control plane management based on the physical topology of nodes in software-defined networks (SDNs) is provided. A tree structure in an SDN such as an access network is identified. Control plan management is provided using the tree structure. A controller configures changes in the SDN and provides notifications to other controllers after configuring devices under its control. A controller prioritizes the status of downstream and/or upstream devices based on a type or direction of data flow when making configuration decisions. A controller provides notifications to other controllers by prioritizing notifications based on the hierarchical position of devices.

Controller communications in access networks

A scanning electron microscope incorporates a multi-pixel solid-state electron detector. The multi-pixel solid-state detector may detect back-scattered and/or secondary electrons. The multi-pixel solid-state detector may incorporate analog-to-digital converters and other circuits. The multi-pixel solid state detector may be capable of approximately determining the energy of incident electrons and/or may contain circuits for processing or analyzing the electron signals. The multi-pixel solid state detector is suitable for high-speed operation such as at a speed of about 100 MHz or higher. The scanning electron microscope may be used for reviewing, inspecting or measuring a sample such as unpatterned semiconductor wafer, a patterned semiconductor wafer, a reticle or a photomask. A method of reviewing or inspecting a sample is also described.

Scanning electron microscope and methods of inspecting and reviewing samples

Pixel aperture size adjustment in a linear sensor is achieved by applying more negative control voltages to central regions of the pixel's resistive control gate, and applying more positive control voltages to the gate's end portions. These control voltages cause the resistive control gate to generate an electric field that drives photoelectrons generated in a selected portion of the pixel's light sensitive region into a charge accumulation region for subsequent measurement, and drives photoelectrons generated in other portions of the pixel's light sensitive region away from the charge accumulation region for subsequent discard or simultaneous readout. A system utilizes optics to direct light received at different angles or locations from a sample into corresponding different portions of each pixel's light sensitive region. Multiple aperture control electrodes are selectively actuated to collect/measure light received from either narrow or wide ranges of angles or locations, thereby enabling rapid image data adjustment.

Growing community of inventors

San Jose, CA, United States of America

Jingjing Zhang