Huawei Technologies Co., Limited

Jinghui Xu

Zhihong Feng

Ming Li

Hui Yang

Jun Feng

Jifang He

Xiaoshi Dong

Wenzhe Liao

Fengpei Sun

Danyang Yao

Anping Qiu

Qin Shi

Qifang Hu

Guoqiang Wu

Shangshu Yang

Zhongye Wu

Huai Yuan Chu

An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is connected to the movable portion and the fastening portion. A first avoidance slot is disposed on a face that is of the movable portion and that faces the fastening assembly. The fastening assembly is grounded. A boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly. The boss is connected to the fastening portion and configured to support the fastening portion. The first position limiting pole corresponds to the first avoidance slot. The drive assembly is connected to the movable portion to drive the movable portion to move.

MEMS chip, manufacturing method thereof, MEMS device, and electronic device

An MEMS device includes a package, a bottom plate, and a first inertial component. The first inertial component is located in packaging space formed by the bottom plate and the package. There is a first alignment part on a surface that is of the bottom plate and that faces the packaging space, and the first inertial component has a first mounting part. A shape of the first mounting part matches a shape of the first alignment part. The MEMS device is equipped with a mounting alignment reference, the first mounting part is connected to the first alignment part, and the first inertial component is mounted on the bottom plate at a preset angle. In addition, a bottom part of the first inertial component is not directly connected to the bottom plate.

MEMS device

A camera module is provided. The camera module may be separately used as a camera, or may be applied to a terminal device such as a mobile phone or a tablet computer, or a vehicle-mounted device. The camera module includes an optical lens component, a light filtering layer, an image sensor and a drive module. The optical lens component is configured to receive a light beam from a photographed object, and transmit the light beam to the light filtering layer. The light filtering layer is configured to move a position under the drive of the drive module, and respectively transmit light signals filtered at different positions to the image sensor. The image sensor is configured to receive the light signals at the different positions from the light filtering layer, and determine image information based on the light signals at the different positions.

Camera module, camera, terminal device, and method for determining image information

This application discloses example piezoelectric acoustic sensors and methods for manufacturing the piezoelectric acoustic sensor, and belongs to the field of electronic technologies. In one example, the piezoelectric acoustic sensor includes an anchoring unit, a piezoelectric unit, a support unit, and a hollow-out mechanical part. A back cavity is formed in the anchoring unit. The piezoelectric unit is configured to convert a sound signal that enters the back cavity into an electrical signal. The support unit covers the anchoring unit and the piezoelectric unit. The hollow-out mechanical part is connected between the anchoring unit and the piezoelectric unit, and is embedded in the support unit.

Piezoelectric acoustic sensor and method for manufacture thereof

Growing community of inventors

Shenzhen, China

Jinghui Xu