Cypress Semiconductor Corporation

Other

Jinghui Mu

Yansun Xu

Brian Todoroff

Brett Alan Spurlock

John Frame

KeCai Zeng

Optical navigation modules and methods of operating the same to sense relative movement between the optical navigation module and a tracking surface are provided. In one embodiment, the optical navigation module comprises: (i) a light source to illuminate at least a portion of a surface relative to which the optical navigation module is moved; (ii) an integrated circuit (IC) including a photo-detector array (PDA) to detect a light pattern propagated onto the PDA from the surface, and a signal processor to translate changes in the light pattern propagated onto the PDA into data representing motion of the optical navigation module relative to the surface; and (iii) a substrate to which the light source and IC are mounted, the substrate including an aperture in a light path between the surface and the PDA. Other embodiments are also disclosed.

Optical navigation module with capacitive sensor

A hybrid sensor module and methods of operating the same are provided. In one embodiment, the hybrid sensor module includes: (i) a touch sensor configured to sense motion of an object in proximity to a surface of the touch sensor; (ii) an optical navigation sensor (ONS) configured to illuminate the object through the surface of the touch sensor and to sense motion of the object based on light returned from the object; and (iii) a controller electrically coupled to the touch sensor and the ONS to process the sensed motion of the object and to generate an output signal in response to the sensed motion, wherein the controller is configured to dynamically adjust a tracking resolution of the hybrid sensor module based on a characteristic of the sensed motion. Other embodiments are disclosed.

Hybrid sensor module

A tape ball grid array (TBGA) package and method for fabricating the package utilizes at least one electrical connection between a conductive stiffener and a patterned metal layer of a tape substrate, which is connected to a solder ball that is designated to be connected to AC ground, so that the conductive stiffener can be AC grounded. The electrical connection between the conductive stiffener and the AC ground-designated solder ball may be achieved by wirebonding the conductive stiffener to the patterned metal layer of the tape substrate. Since the conductive stiffener can be AC grounded, the conductive stiffener can be used as an electromagnetic interference (EMI) shield.

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San Jose, CA, United States of America

Jinghui Mu