Shanghai Micro Electronics Equipment (Group) Co., Ltd.

Shanghai Micro Electronics Equipment Co., Ltd.

Jingchao Qi

Feibiao Chen

Chang Jin Zhou

Song Guo

Qi Cheng

Yaping Ge

Yuefei Chen

Lei Diao

A flip-chip bonding device and method are disclosed. The bonding device includes: a supply unit () for separating a flip-chip () from a carrier () and providing the flip-chip (), the supply unit () including flipping device (); a transfer unit () for receiving the flip-chip () from the flipping device (); a position adjustment unit () for adjusting the positions of flip-chips () on the transfer unit (); a bonding unit () for bonding the flip-chips () on the transfer unit () onto a substrate (); a transportation unit () for transporting the transfer unit (); and a control unit () for controlling the movement of the preceding units. The transfer unit () is capable of receiving multiple flip-chips () and allows the flip-chips () to be bonded simultaneously. This can result in savings in bonding time and an improvement in throughput. Moreover, during the transportation of the transfer unit (), the positions of the flip-chips () thereon can be adjusted by the position adjustment unit (), thereby ensuring high positional accuracy of the flip-chips () in the subsequent bonding step. As a result, a high-accuracy bonding can be achieved.

Flip chip bonding device and bonding method

Disclosed is an adaptive groove focusing and leveling device for measuring the height and the inclination of the surface of a measured object (). The measured object () is provided with cyclic grooves () in the surface and supported by a moving table; the focusing and leveling device sequentially comprises an illumination unit, a projection unit, a detection unit and a detector (); the measured object () is positioned between the projection unit and the detection unit along the light path, the projection unit comprises a projection slit () and is used for forming a plurality of measuring points () on the measured object (), and each measuring point () comprises at least three measuring child light spots (), wherein the at least three measuring child light spots () are arranged at unequal intervals, so that when the plurality of measuring points () are projected to the surface of the measured object (), at least two of the at least three measuring child light spots () of each measuring point () can be positioned outside the grooves (), and then the height and the inclination of the surface of the measured object () are measured.

Adaptive groove focusing and leveling device and method

In an exposure apparatus and a method for defocus and tilt error compensation, each of alignment sensors () corresponds to and has the same coordinate in the first direction as a respective one of focusing sensors (), so that each of the alignment sensors () is arranged on the same straight line as a respective one of the focusing sensors (). As such, alignment marks can be characterized with both focusing information and alignment information. This enables the correction of errors in the alignment information and thus achieves defocus and tilt error compensation, resulting in significant improvements in alignment accuracy and the production yield.

Exposure device and out-of-focus and tilt error compensation method

Growing community of inventors

Shanghai, China

Jingchao Qi