Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Jingbo Wang

Masatoshi Nishio

Hitoshi Nishimura

Makoto Ryudo

Ryo Ishikawa

Doukei Nagayasu

Hideaki Yamaguchi

Yoshiaki Takenaka

Kiyotaka Eizumi

Manabu Nishihara

Kenzo Shibata

Yasushi Mukai

Hiroyuki Hayashikawa

Takasi Kakutani

Motoki Morioka

Mitsuru Mukai

Tsutomu Sugiyama

Shunsuke Kawai

Laser welding device () includes: laser oscillator (); optical fiber () that transmits a laser beam (LB) generated in laser oscillator (); laser beam emitting head () that is attached to the emission end of optical fiber () and emits laser beam (LB) toward workpiece (); manipulator () with laser beam emitting head () attached thereto; and controller () that controls laser beam emitting head () so as to cause laser beam (LB) to be scanned three-dimensionally on the surface of workpiece (). Controller () controls laser beam emitting head () so as to change a focal position of laser beam (LB) in accordance with a shape of a welded portion in workpiece ().

Laser welding device with changing focal position and laser welding method using same

A laser processing device includes a laser oscillator, an optical fiber that is a multi-clad fiber, a beam control mechanism provided in the laser oscillator, and a laser light emitting head attached to the optical fiber. The beam control mechanism includes a condenser lens, an optical path changing and holding mechanism that is disposed between the condenser lens and an incident end face of the optical fiber and changes an optical path of laser light LB, and a controller that controls an operation of the optical path changing and holding mechanism. The beam control mechanism controls a power distribution of the laser light by changing an incident position of the laser light on the incident end face.

Laser processing device and laser processing method using same

A laser processing device includes a laser oscillator, optical fiber (), beam control mechanism (), and a laser light emitting head. The laser oscillator includes first and second laser oscillation units that generate first and second laser light rays (LB) and (LB), respectively. Beam control mechanism () includes optical path changing and holding mechanism () that is disposed between second condenser lens () that condenses second laser light (LB) and dichroic mirror () that multiplexes first and second laser light rays (LB) and (LB) and causes the multiplexed light to be incident on optical fiber (). Beam control mechanism () changes an incident position of second laser light (LB) on optical fiber ().

A laser device includes a laser oscillator, a dehumidifier, and a controller controlling an operation of the dehumidifier. The controller controls the dehumidifier such that the dew point inside the laser oscillator is lower than the first dew point when a monolayer or less of water molecules is adsorbed, or such that the dew point is equal to or higher than the second dew point when more than a monolayer of water molecules is adsorbed inside the laser oscillator, and is lower than the third dew point at which the dew condensation starts to occur inside the laser oscillator.

Laser device and dehumidification management method for laser device

A detector is configured to detect an output of a reflected beam from an exit end surface of a parallel plate. A determination unit is configured to determine that an abnormality occurs in the parallel plate when a detection value of the detector is smaller than a determination threshold.

Laser machining device

Laser processing device () includes: laser-beam switching apparatus () that switches between a first optical path and a second optical path as an optical path along which a laser beam is to travel, the first optical path including first fiber (), the second optical path including second fiber () that has a core diameter that is larger than a core diameter of first fiber (); and processing head () that illuminates a same processed point on workpiece () with a laser beam that has passed through the first optical path or the second optical path. When illumination with laser beam that has passed through the first optical path is performed for a predetermined period of time, laser-beam switching apparatus () switches from the first optical path to the second optical path.

Laser processing device and laser processing method

There is provided an optical axis alignment mechanism between the laser oscillator and the optical fiber. The laser oscillator emits laser light, which then emerges from the emission end of the optical fiber via the axis alignment mechanism. Part of the laser light is received on the light-receiving surface of the CCD camera of a laser light evaluator. Thus, the laser light evaluator acquires a light intensity distribution. The light intensity distribution is used by the optical axis alignment mechanism to align the axis of the laser oscillator with the axis of the optical fiber.

Alignment method

A laser processing head includes parallel plate () that shifts an optical axis of a laser beam to be emitted from a top to a bottom of body case () from a first optical axis to a second optical axis, parallel plate () that shift the optical axis of the laser beam from the second optical axis to a third optical axis, and body case () that accommodates holders (and) that respectively hold parallel plates (and). The laser processing head further includes a rotation mechanism that rotates holders (and) around a first rotary axis. Opening () that a laser beam reflected by an incident surface of second parallel plate () passes through is formed in holder (), and light receiving part () that receives the laser beam having passed through opening () is disposed in body case ().

Laser processing head and laser processing device using same

A laser device includes: a laser resonator for emitting a laser beam; a condenser lens for collecting the laser beam emitted from the laser resonator; an optical fiber for transmitting the laser beam collected by the condenser lens; at least one light sensor opposing a light receiving surface of the condenser lens and outside an optical path of the laser beam, the at least one light sensor detecting an amount of return light from the condenser lens; and a controller for determining a presence of an abnormality when a value of the amount detected by the at least one light sensor is greater than a predetermined maximum threshold.

Laser device

A fiber coupling device () includes the following components: a wedge plate () for receiving light and refracting the light in a predetermined direction, a condenser lens () for collecting the light refracted by the wedge plate (); and an optical fiber () having an incident surface for receiving the light collected by the condenser lens (). The wedge plate () is held rotatable around the optical axis () of the light incident on the wedge plate (). The light refracted by the wedge plate () and collected by the condenser lens () is incident on a different point on the incident surface depending on the rotation angle of the wedge plate ().

Fiber coupling device

A fiber coupling device includes a housing and a window provided in the housing. The fiber coupling device is configured to collectively guide plural laser beams to at least a first fiber, the plurality of laser beams each being emitted from a corresponding one of plural external laser light sources and entering through a laser beam inlet. The housing is configured such that the laser beams enter the housing from the laser beam inlet. The window is provided inside the housing and faces the laser beam inlet. The fiber coupling device is not required to detach when an optical axis is adjusted.

A condenser lens for collecting a laser beam () is disposed between the laser oscillator and the incident end surface of the optical fiber. The laser beam () is divided into a plurality of beams (). The power of the laser beam () is measured and maximized by adjusting the position of the condenser lens. The FFP of the laser beam () is measured and minimized by adjusting the position of the condenser lens. These adjusted positions are stored as the first and second lens positions. The FFP of the laser beam () is measured while the condenser lens is being moved between these positions so as to make the BPP not more than a predetermined value.

Core adjustment method

Disclosed is a method for hybrid welding in which a laser beam is applied to the welding position of objects to be welded, and at the same time, a first wire is fed to the welding position so as to perform arc welding using an arc generated between the objects to be welded and the first wire. In this method, one or more second wires are fed to a molten weld pool formed by the laser beam and arc welding, thereby increasing the amount of welding without increasing the arc current.

Hybrid welding method and hybrid welding apparatus

A first laser beam is radiated to a first radiation position of a welding object while intersecting a wire, and a second laser beam is radiated to a second radiation position that is spaced a predetermined distance from a target position of the wire. Arc welding is performed between the wire and the welding object while radiating the first laser beam and the second laser beam such that the first radiation position, the second radiation position, and the target position are disposed on a welding line of the welding object. In this way, it is possible to prevent the generation of spatter and perform welding at a high rate, without increasing the size of a molten pool.

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Hyogo, Japan

Jingbo Wang