Texas Instruments Corporation

Jing Sua Goh

Min Yu Chan

Kian Teng Eng

Siu Waf Low

Boon Pew Chan

Chee Kiang Yew

Pak Hong Yee

Tuck Fook Toh

Suan-Jong Jae Boon

Chee C Lau

A package for an integrated circuit includes a circuit board for mounting the integrated circuit having a first surface and a second surface, a connection device positioned on the first surface of the circuit board for electrically connecting the integrated circuit and the integrated circuit being positioned on the second surface of the integrated circuit

Board on chip ball grid array

A method and apparatus for producing an integrated circuit package ( ) comprising a substrate ( ) having an opening ( ) and first and second surfaces ( ), a plurality of routing strips ( ) being integral with the substrate ( ) and extending into the opening ( ), a plurality of pads ( ) disposed on the first and second surfaces ( ) are electrically connected with at least one of the routing strips ( ), wire bonding ( ) electrically connecting at least one bonding pad ( ) to at least one of the routing strips ( ) and a silicon chip ( ) attached to the printed circuit board ( ) by an adhesive material ( ) that provide a seal between silicon chip ( ) and printed circuit board ( ) is disclosed.

Method for adhering and sealing a silicon chip in an integrated circuit package

Integrated circuit package

A reinforced semiconductor package (,) and method utilizes at least one of the grooves (,) and ridges (,) formed on the package body (,) to reinforce the package body (,) to prevent warping of the package after molding.

Reinforced semiconductor package

A method and apparatus for fabricating small form factor semiconductor chips having high temperature resistance, good humidity and chemical resistance and good dielectric properties. The semiconductor chip includes a lead frame (,) attached to an integrated circuit die (,) by a lead-on-chip (LOC) method. Wire bonds (,) are employed to connect the integrated circuit die (,) to conduction leads (,) on the lead frame (,). After the wire bonding process, the surface of the wire bonded integrated circuit is encapsulated with a layer of resin (,) using either a direct dispensing method or by a screen printing method. The encapsulated integrated circuit may then be cured and functionally tested.

Encapsulate resin LOC package and method of fabrication

An integrated circuit package having a top opening and a cavity, with a chip adhered in the cavity. The top opening has routing strips electrically connecting the top opening with the outer surface. The routing strips are electronically connected to bonding pads located in a central area of the chip. Following assembly of the components, the top opening and the cavity are encapsulated in a molding process. A method is provided for forming a substantially flat integrated circuit package.

Integrated circuit package and flat plate molding process for integrated circuit package

A method and apparatus for producing an integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending into the opening (86), a plurality of pads (100) disposed on the first and second surfaces (92, 94) are electrically connected with at least one of the routing strips (82), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and a silicon chip (50) attached to the printed circuit board (70) by an adhesive material (60) that provide a seal between silicon chip (50) and printed circuit board (70) is disclosed.

Method for adhering and sealing a silicon chip in an integrated circuit

A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).

Slotted lead for a semiconductor device

An integrated circuit package (30) including a substrate (70) having an opening (86) and first and second surfaces(92, 94), a plurality of pads (100) disposed on the first and second surfaces (92, 94) having disposed thereon solder balls (150) electrically connected by a via (84) that provides the end-user with flexibility in the location of a power supply Pin (96) is disclosed.

Flexible pin location integrated circuit package

The invention is to a double side semiconductor module (10) and an array (40) made up of a plurality of stacked modules (10). Each module (10) includes a plurality of substrates (11-15). A first substrate (13) has first and second sides, with one semiconductor device (16,25) having bond pads thereon (17,26), mounted on each of said first and second sides. At least one additional substrate (12,14) having a central opening (12b,14b), is placed on each of said first and second sides with the semiconductor device (16,25) mounted in the central opening (12b,14b). A plurality of solder pins (11a-15a), associated with each of said substrates (11-15) are connected to contact pads (17,26) on the semiconductor devices (16,25), and extend from and to openings in said substrates (11-15).

Multiple chip module apparatus having dual sided substrate

Method of attachment of a semiconductor slotted lead to a substrate

A system (30) and method for preheating molding compound in the form of resin pellets (20) used in molding integrated circuits (50). A slanted plate (36) is connected to an electrode (31) to preheat resin pellets (20). The slanted plate (36) produces a temperature gradient in pellets (20) with a high temperature end (21) and a lower temperature end (22). A preheated pellet (20) with the lower temperature end (22) first is placed in a mold pot (40). A transfer ram (46) contacts the high temperature end (21) of the pellet (20) to deform the pellet (20) and fill any void spaces between the pellet (20) and surrounding mold pot bushing (44). The ram (46) continues to deform the pellet (20) to force air or other gases from the mold pot bushing (44) and to inject molding compound into a mold cavity (42).

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Singapore, Singapore

Jing Sua Goh