Oracle America, Inc.

Oracle International Corporation

Leland Stanford Junior University

Jing Shi

Ashok V Krishnamoorthy

Hiren D Thacker

John E Cunningham

David C Douglas

Bruce M Guenin

Darko R Popovic

Dawei Huang

Lawrence Steinman

Ivan Shubin

Matthew David Giere

Michael C Walker

Rajesh Kumar

Deqiang Song

Zuxu Qin

Nyles I Nettleton

Robert C Axtell

John A Harada

May H Han

Brigit A De Jong

Chander Raman

Theresa Y Sze

Compositions and methods are provided for prognostic classification of inflammatory diseases, e.g. inflammatory demyelinating disease, patients into subtypes, which subtypes are informative of the patient's need for therapy and responsiveness to a therapy of interest. The patterns of cytokines provides for a signature pattern that can identify patients likely to benefit from therapeutic intervention as well as discriminate patients that have a high probability of responsiveness to a therapy from those that have a low probability of responsiveness. Assessment of this signature pattern thus allows improved methods of care. In one embodiment of the invention, the autoimmune disease is multiple sclerosis or neuromyelitis optica.

Markers for determination of patient responsiveness

A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM.

Assembly of multi-chip modules with proximity connectors using reflowable features

A receiver circuit includes a first slicer coupled to receive data signals from a signal path and a reference voltage from a reference voltage path that is separate from the signal path. The first slicer is configured output a logic value based on a comparison between a voltage of the data signal and the reference voltage. The receiver circuit further includes a reference voltage generator configured to generate the reference voltage. The reference voltage generator is configured to dynamically generate the reference voltage based on logic values of previously received signals during operation in a first mode. During operation in a second mode, the reference voltage generator is configured to generate and provide the reference voltage as a static voltage.

Direct feedback equalization with dynamic referencing

A multi-chip module (MCM) is described. This MCM includes two substrates, having facing surfaces, which are mechanically coupled. Disposed on a surface of a first of these substrates, there is a negative feature, which is recessed below this surface. A positive feature in the MCM, which includes an assembly material other than a bulk material in the substrates, at least in part mates with the negative feature. For example, the positive feature may be disposed on the surface of the other substrate. Alternatively, prior to assembly of the MCM, the positive feature may be a separate component from the substrates (such as a micro-sphere). Note that the assembly material has a bulk modulus that is less than a bulk modulus of the material in the substrates. Furthermore, at least a portion of the positive feature may have been sacrificed when the mechanical coupling was established.

Assembly of multi-chip modules using sacrificial features

In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a 'plank stack') are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.

Chip package with plank stack of semiconductor dies

A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.

Mechanical coupling in a multi-chip module using magnetic components

A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.

Self-locking features in a multi-chip module

A base mechanism for use in a multi-chip module (MCM) is described. This base mechanism includes a substrate having top and bottom surfaces. The bottom surface includes first electrical connectors that convey power, and through-substrate vias (TSVs) between the top and bottom surfaces are electrically coupled to these electrical connectors. Furthermore, a bridge chip is rigidly mechanically coupled to the top surface. This bridge chip includes proximity communication connectors that communicate information via proximity communication with one or more island chips in the MCM. Additionally, spacers are rigidly mechanically coupled to the top surface of the substrate. In conjunction with the bridge chip, the spacers define cavities on the top surface, which include second electrical connectors. These second electrical connectors are electrically coupled to the TSVs, and communicate additional information with and convey power to the one or more island chips.

Base plate for use in a multi-chip module

A single-chip module (SCM) and a multi-chip module (MCM) that includes at least two instances of the SCM are described. The SCM includes a pad disposed on a substrate. This pad has a top surface that includes a pattern of features. A given feature in the pattern of features has a height that extends above a minimum thickness of the pad, thereby increasing a capacitance associated with the pad relative to a configuration in which the top surface is planar. Furthermore, pads disposed on the two instances of the SCM in the MCM may each have a corresponding pattern of features that increases the capacitive coupling between the pads relative to a configuration in which the top surfaces of either or both of the pads are planar. Note that the pads may be aligned such that features in the patterns of features on these pads are interdigited with each other.

Growing community of inventors

Carlsbad, CA, United States of America

Jing Shi