Other

Anpec Electronics Corporation

Nien-yi Industrial Corporation

Jing-Qing Chan

Yi-Chun Shih

Chih-Hung Chen

Yung-Fa Lin

Shou-Yi Hsu

Meng-Wei Wu

Main-Gwo Chen

Tung-Lou Lin

Zeng-Xin Guo

Guan-Shiou Chen

Wen-Cheng Wu

The photoelectric signal conversion and transmission device includes a photoelectric signal module and a fiber joint, matched and coupled together. A circuit board of the photoelectric signal module includes one or more connection bases. Light emission elements, light reception elements, and amplifiers are configured on a first coupling face of the connection based, and electrically connected by first and second wires. The fiber joint includes a number of fibers axially aligned with the light emission and reception elements. By having the light emission and reception elements and amplifiers configured on a same coupling face, their physical connection distance is reduced, thereby decreasing signal attenuation, enhancing signal transmission performance, and facilitating structural miniaturization.

Photoelectric signal conversion and transmission device

A connector fixing structure having a transmission plug and an adapter plug; wherein the transmission plug is respectively set with a first magnetic element, a guide slot, and a positioning groove; and the adapter plug is respectively set with a signal jack, a second magnetic element, a protruding block, and a resilient piece at the positions of the connection section. The first plug of small size set in the transmission plug can electrically connected with the signal jack. And, the first magnetic element and the second magnetic element can be mutually adsorbed, the protruding block can be mutually combined, and the positioning groove can be mutually engaged with the resilient piece. Therefore, the multi-point stable combination between the transmission plug and the adapter plug is achieved. It also enables the first plug to perform the connection ability after the second plug penetrates through the fitting hole of smaller size.

Connector fixing structure

A method for forming a power device includes the following steps. An epitaxial layer is formed on a substrate. A pad layer and hard mask are formed on the epitaxial layer. A trench is etched into the hard mask, the pad layer, and the epitaxial layer. The hard mask is removed. A buffer layer is formed on the sidewall of the trench. The trench is then filled with a dopant source layer comprising plural dopants. A drive-in process is performed to diffuse the dopants into the epitaxial layer through the buffer layer, thereby forming a diffusion region around the trench.

Method for fabricating a semiconductor power device

Growing community of inventors

Taipei, Taiwan

Jing-Qing Chan