Other

Analog Devices,inc.

Jing Cheng Luo

Lawrence E Felton

David J Collins

Robert R Alfano

John R Martin

Yury Budansky

Craig E Core

Peter Farrell

William A Webster

Hong Feng Du

A MEMS capping method and apparatus uses a cap structure on which is formed a MEMS cavity, a cut capture cavity, and a cap wall. The cap wall is essentially the outer wall of the MEMS cavity and the inner wall of the cut capture cavity. The cap structure is bonded onto a MEMS structure such that the MEMS cavity covers protected MEMS components. The cap structure is trimmed by cutting through to the cut capture cavity from the top of the cap structure without cutting all the way through to the MEMS structure.

MEMS capping method and apparatus

A wafer cap protects micro electromechanical system (&ldquo;MEMS&rdquo;) structures during a dicing of a MEMS wafer to produce individual MEMS dies. A MEMS wafer is prepared having a plurality of MEMS structure sites thereon. Upon the MEMS wafer, the wafer cap is mounted to produce a laminated MEMS wafer. The wafer cap is recessed in areas corresponding to locations of the MEMS structure sites on the MEMS wafer. The capped MEMS wafer can be diced into a plurality of MEMS dies without causing damage to or contaminating the MEMS die.

Method and device for protecting micro electromechanical systems structures during dicing of a wafer

A method for capping active areas of a semiconductor wafer uses photolithography to define areas of sealant on the cap wafer to thereby reduce the amount of space required for attaching the cap wafer to the semiconductor wafer carrying active areas to be capped. Using photolithography in this manner increases the amount of space on the semiconductor wafer that can be used to form active areas which, in turn, improves the density of active area on the semiconductor wafer. In one embodiment, the method includes the steps of applying a photoimageable layer, photoimaging the photoimageable layer to define a pattern including remaining regions of the photoimageable layer and removed regions of the photoimageable layer, and using the pattern to define the sealant regions on the semiconductor wafer. The method may further include one or more steps, such as applying sealant to the sealant regions defined by the pattern, curing the sealant, removing the remaining regions after applying the sealant to the sealant regions, removing excess sealant not within the sealant regions, and using the sealant material to form at least one seal around at least one active area formed on the second semiconductor substrate.

Method of forming a cover cap for semiconductor wafer devices

An infrared proximity and remote control wall switch positioned between a fixture and a voltage source for allowing a fixture to operate in one of a manual and automatic mode. The infrared proximity and remote control wall switch includes a three position switch operable between a first on position connecting the fixture directly to the voltage source, a second off position for disconnecting the fixture from the voltage source and a third auto position for allowing automatic operation of the fixture. An infrared emitter generates an infrared signal and an infrared receiver is connected to receive one of the infrared signal generated by the infrared emitter and reflected by an object and an infrared signal generated by a conventional television, video cassette recorder or hi-fi remote control unit. A device is connected to the infrared receiver for filtering the signal received by said infrared receiver and eliminate noise signals therefrom. Connected to the filtering device acts to connect the fixture to the voltage source upon receipt of a filtered signal from the filtering device. This device is able to eliminate noise signals from affecting the operation of the fixture when the switch is in the auto position and is able to activate the fixture to turn on at a plurality of different intensities. A timer may also be included for turning the fixture off after a predetermined period of time has passed since activation.

Infrared proximity and remote control wall switch

A photonic paper product dispenser is provided for dispensing a portion of a roll of a paper product. The photonic paper product dispenser comprises a housing which holds the roll of the paper product. The dispenser further comprises a light source for emitting an infrared light signal and a photodetector affixed to the housing which detects infrared light from the source reflected by the user and converts the light to electrical signals. The dispenser further includes a signal processing circuit in electrical connection with the photodetector. The signal processing circuit receives and processes signals sent by the photodetector. The dispenser further includes a motor in electrical connection with said signal processing circuit. The dispenser further includes a pair of gears mechanically connected to the motor which rotate upon activation of the motor. The gears are mechanically connected to one of a pair of rollers, the roller rotating upon rotation of the gears. The pair of rollers are mounted in the housing so that they are frictionally engaged with the roll of the paper product. The roll of the paper product is fed tautly between the pair of rollers. As the roller connected to the gears rotates, the roll of the paper product will rotate causing a sheet of the paper product to advance out from the dispenser which can then be removed from the roll by the user without having to touch any part of the dispenser.

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New York, NY, United States of America

Jing Cheng Luo