Average Co-Inventor Count = 2.75
ph-index = 29
The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.
Company Filing History:
1. Taiwan Semiconductor Manufacturing Comp. Ltd. (490 from 40,053 patents)
2. Sky Tech Inc. (24 from 48 patents)
3. Micron Technology Incorporated (2 from 37,640 patents)
4. Other (1 from 832,347 patents)
517 patents:
1. 12424587 - Semiconductor device having underfill surrounding bottom package and solder ball
2. 12387996 - Through-substrate vias with improved connections
3. 12368090 - Method of manufacturing semiconductor device including passivation layer
4. 12362260 - Methods of packaging semiconductor devices and packaged semiconductor devices
5. 12266612 - Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features
6. 12249581 - Method of manufacture overlay mark using laser marking process for semiconductor device
7. 12237291 - Dummy structure of stacked and bonded semiconductor device
8. 12237238 - Package structure and method
9. 12191287 - Package structure
10. 12170242 - Fan-out wafer level package structure
11. 12148661 - Method of forming integrated fan-out packages with built-in heat sink
12. 12131898 - Bonded semiconductor structures
13. 12125721 - Parallelism-adjustable bonding machine
14. 12080617 - Underfill structure for semiconductor packages and methods of forming the same
15. 12068224 - Semiconductor packages having thermal conductive pattern