Peking University

Other

Hangzhou Haicun Information Technology Co., Ltd.

Xiamen Haicun IP Technology LLC

Jinfeng Kang

Xiaoyan Liu

Lifeng Liu

Bin Gao

Bing Chen

Peng Huang

Feifei Zhang

Yi Wang

Guobiao Zhang

Hongyu Yu

Bin Yu

Runze Han

Bing Jiang Sun

Jin He

Chen Shen

Yulin Feng

Yi Hou

Dedong Han

Chenchang Zhan

Yuhua Cheng

RangYu Deng

XiangDong Lu

XuGuang Wang

DongYun Zhang

ZhiWei Liu

Yuansha Chen

Jiaqi Yang

Jingfeng Yang

Yachen Xiang

Yizhou Zhang

An operating circuit and an operating method of a resistive random-access memory are provided, the operating circuit includes: at least one capacitance connected in series with the resistive random-access memory, so that the resistive random-access memory is grounded through the at least one capacitance. The operating method includes: connecting at least one capacitance in series with a resistive random-access memory, so that the resistive random-access memory is grounded through the capacitance; applying a forming pulse voltage or a set pulse voltage on the resistive random-access memory to achieve a forming operation or a set operation of the resistive random-access memory.

Operating circuit and operating method of resistive random access memory

A system and a method for compressing an image based on a FLASH in-memory computing array are provided. The system includes: a convolutional neural network for encoding of the FLASH in-memory computing array, a convolutional neural network for decoding based on the FLASH in-memory computing array, and a quantization module; the convolutional neural network for encoding based on the FLASH in-memory computing array is configured to encode an original image to obtain a feature image; the quantization module is configured to quantize the feature image to obtain a quantized image; the convolutional neural network for decoding based on the FLASH in-memory computing array is configured to decode the quantized image to obtain a compressed image.

System and method for compressing image based on flash in-memory computing array

The present disclosure relates to the field of semiconductor integrated circuits and manufacturing technologies thereof, and discloses a method and device for realizing a convolution operation based on an NOR flash storage structure. The NOR flash array has a structure of an array composed of a plurality of NOR flash cells. The convolution operation method includes: storing elements of a convolution kernel matrix into the NOR flash cells; converting elements of an input matrix into voltages and applying the voltages to gate terminals of the NOR flash cells; applying a driving voltage to source terminals of the NOR flash cells; and collecting, via drain terminals of the NOR flash cells, current values of each column to obtain a convolution operation result.

Convolution operation method based on NOR flash array

The present disclosure provides a data search system and a data search method for determining whether there is stored information data matched with query information data in a storage circuit. The data search system comprises a storage circuit, a control circuit, and a feature extraction circuit, wherein the storage circuit comprises at least one storage unit which comprises a memristor crossbar array, a read/write unit, a decoder and a multiplexer, and the feature extraction circuit is configured to extract feature values of the query data. In the data search method, both the data matching process and the data storage process are performed in the memristor crossbar array under the control of the control circuit, which thus largely reduces the amount of data transmission while greatly improving the speed of data search using the characteristics of parallel calculation of the memristor crossbar array.

Data search systems and methods

The present disclosure discloses a full adder based on resistive-switching devices and an operation method thereof. A multi-bit full adder circuit is constituted by using a cross-bar array of resistive-switching devices, wherein data of standard sums is stored on the principle diagonal of the cross-bar array in a nonvolatile manner, and carry data is stored in adjacent units on both sides of the principle diagonal. The carry data is stored according to whether the storage loop (crosstalk loop) is turned on. With the present disclosure, the multi-bit full adder circuit is significantly simplified. Thereby, additional circuits for generating a carry signal are reduced, the circuit delay and chip area are decreased, and the adder has an ability of nonvolatile storage.

Multi-bit full adder based on resistive-switching devices and operation methods thereof

The present invention discloses a three-dimensional one-time-programmable memory (3D-OTP) comprising an off-die address/data-translator (A/D-translator). It comprises at least a 3D-array die and at least a peripheral-circuit die. At least an A/D-translator of the 3D-OTP arrays is located on the peripheral-circuit die instead of the 3D-array die. The A/D-translator converts at least an address and/or data between logic and physical spaces.

Three-dimensional one-time-programmable memory comprising off-die address/data-translator

The present invention discloses a small-grain three-dimensional memory (3D-MSG). Each of its memory cells comprises a thin-film diode with critical dimension no larger than 40 nm. The thin-film diode comprises at least a small-grain material, whose grain size G is substantially smaller than the diode size D. The small-grain material is preferably a nano-crystalline material or an amorphous material. The critical dimension f of the small-grain diode is smaller than the critical dimension F of the single-crystalline transistor.

Small-grain three-dimensional memory

A method for measuring data retention characteristic of an RRAM device includes: a) controlling a temperature of a sample stage to maintain the RRAM device at a predetermined temperature; b) setting the RRAM device to a high-resistance state or a low-resistance state; c) measuring data retention time by applying a predetermined voltage to the RRAM device so that a resistive state failure of the RRAM device occurs; d) repeating the steps a)-c) to perform a plurality of measurements; e) calculating a resistive state failure probability F(t) of the RRAM device from the data retention time in the plurality of measurements; and f) fitting the resistive state failure probability F(t), and calculating predicted data retention time tby using parameters obtained from the fitting. The data retention time of the RRAM device may be predicted by combining voltage acceleration and temperature acceleration.

Method for measuring data retention characteristic of resistive random access memory device

A resistive switching memory device and a method for operating the same are disclosed. The device includes a plurality of resistive switching memory units arranged in a matrix, each of which includes a switching element and a resistive switching device, and the switching element being connected to a word line at its control terminal, to the resistive switching device at one terminal, and to a bit line at the other terminal; a word line decoder adapted to decode an input address signal to switch on the switching element in at least one of resistive switching memory units; and a driving circuit adapted to apply a voltage pulse whose front edge changes slowly across the resistive switching device by the bit line synchronously with the switching-on of the switching element. Using the scheme of the above embodiments, the durability characteristic of the resistive switching device can be improved, such as degradation of high-low resistance value window and the failure of the device with transition times can be reduced.

Resistive switching memory device and method for operating the same

A resistive random access memory device, a method for manufacturing the resistive random access memory device, and a method for operating the resistive random access memory device are disclosed. The resistive random access memory device includes a resistive switching memory element including two electrodes and a layer of variable-resistance material between the two electrodes, wherein the layer of variable-resistance material exhibits bipolar resistive switching behavior; and a Schottky diode including a metal layer and a p-doped semiconductor layer which contact each other, wherein the metal layer of the Schottky diode is coupled to one of the two electrodes of the resistive switching memory element. The present disclosure provides the resistive random access memory device operating in bipolar resistive switching scheme.

Resistive random access memory device, method for manufacturing the same, and method for operating the same

A resistive-switching random access memory device includes a memory cell disposed between a bit line and a word line, the memory cell having a resistive-switching element () and a Schottky diode (). The Schottky diode () and the resistive-switching element () are connected in series. The Schottky diode () includes a metal layer and a semiconductor layer contacting each other. An interface between the metal layer and the semiconductor layer has a non-planar shape.

Resistive-switching device capable of implementing multiary addition operation and method for multiary addition operation

The present disclosure provides a resistive-switching device capable of implementing multiary addition operation and a method for implementing multiary addition operation using the resistive-switching device. The resistive-switching device has a plurality of resistance values each corresponding to a respective data value stored by the resistive-switching device and ranging from a high resistance value to a low resistance value. The data value stored by the resistive-switching device is increased by '1' successively with a series of set pulses having a same pulse width and a same voltage amplitude being applied thereto. The data value stored by the resistive-switching device is set to '0' with a reset pulse being applied thereto, and meanwhile a data value stored by a higher-bit resistive-switching device is increased by &#x2018;1&#x2019; with a set pulse being applied thereto. In this way, multiary addition operation is implemented.

A neuron device includes a bottom electrode, a top electrode, and a layer of metal oxide variable resistance material sandwiched between the bottom electrode and the top electrode, in which the neuron device is switched to a normal state upon application of reset pulse, and is switched to an excitation state upon application of stimulus pulses. The neuron device has a comprehensive response to different amplitude, different width of a stimulus voltage pulse and different number of a sequence of stimulus pulses, and provides functionalities of a weighting section and a computing section. The neuron device has a simple structure, excellent scalability, quick speed, low operation voltage, and is compatible with the conventional silicon-based CMOS fabrication process, and thus suitable for mass production. The neuron device is capable of performing many biological functions and complex logic operations.

Three-layered neuron devices for neural network with reset voltage pulse

The invention provides a method of testing reliability of a semiconductor device, wherein the semiconductor device has negative bias temperature instability NBTI. The method comprises steps of: measuring a NBTI curve of a first set of semiconductor devices; measuring 1/f noise power spectrum density and drain current at a predetermined frequency for the first set of the semiconductor devices, under a condition that the first set of the semiconductor devices are biased at a gate electric field; measuring an equivalent oxide thickness EOT of gate dielectric of the first set of the semiconductor devices; measuring 1/f noise power spectrum density and drain current at the predetermined frequency for a second set of semiconductor devices, under a condition that the second set of the semiconductor devices are biased at the gate electric field; measuring an EOT of gate dielectric of the second set of the semiconductor devices; and evaluating a degradation characteristic of the second set of the semiconductor devices by using the NBTI curve of a first set of the semiconductor devices. The method saves the time required for testing the reliability of a large numbers of semiconductor devices, and will not cause damages to the second set of semiconductor devices.

Growing community of inventors

Beijing, China

Jinfeng Kang