Lg Innotek Co., Ltd.

Jina Gu

Sung Jin Yun

Se Woong Na

Jae Man Park

Young Ju Han

Hyun Gu Im

Sanga Ju

Gun Young Gil

A light-emitting device according to an embodiment of the present invention includes a substrate; a light-emitting structure provided on the substrate, and including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer provided between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode provided on the light-emitting structure; a first connecting electrode provided on the first electrode; a second electrode provided on the light-emitting structure; a second connecting electrode provided on the second electrode; and a support layer provided around the first electrode, the first connecting electrode, the second electrode and the second connecting electrode. The support layer includes a first support layer having a first coefficient of thermal expansion, and a second support layer provided on the first support layer and having a second coefficient of thermal expansion.

Light-emitting device having a plurality of support layers and light-emitting device package including the same

An epoxy resin composition according to one embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, and the inorganic filler includes boron nitride on which a metal oxide film is formed.

Epoxy resin composite and printed circuit board comprising insulating layer using the same

An inorganic filler includes surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.

Inorganic filler and epoxy resin composition including the same

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Seoul, South Korea

Jina Gu