Cheil Industries Inc.

Jin Young Seo

Dong Seon Uh

Jae Sun Han

Kwang Jin Jung

Hyun Hee Namkung

Hyun Wook Kim

Kyung Il Sul

A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/&#xb0; C. or less at about 100&#xb0; C. or less.

Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film

An electronic device includes an anisotropic conductive adhesive film as a connection material, wherein the anisotropic conductive adhesive film has a flowability of 50% or more after preliminary pressing at 80&#xb0; C. and 1 MPa for 1 second and final pressing at 180&#xb0; C. and 3 MPa for 5 seconds, and a connection resistance increment greater than 0% but not greater than 25%, as calculated by Expression 1:Connection resistance increment (%)=|()/|&#xd7;100&#x2003;&#x2003;(Expression 1)where A is a connection resistance measured after preliminary pressing at 80&#xb0; C. and 1 MPa for 1 second and final pressing at 180&#xb0; C. and 3 MPa for 5 seconds, and B is a connection resistance measured after reliability evaluation at a temperature of 85&#xb0; C. and a humidity of 85% for 250 hours following preliminary pressing and final pressing.

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a phenoxy resin including a fluorene-substituted phenoxy resin; and a radically polymerizable resin including a fluorene-substituted acrylate.

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Uiwang-si, South Korea

Jin Young Seo