Korea Institute of Science and Technology

Lg Electronics Inc.

Amkor Technology, Inc.

Lg Chem, Ltd

Amkor Technology Singapore Holding Pte. Ltd.

Daegu Gyeongbuk Institute of Science and Technology

Seoul National University

Electronics and Telecommunications Research Institute

Lg Innotek Co., Ltd.

Other

Samsung Sdi Co., Inc.

Hyundai Electronics Industries Co. Ltd.

Goldstar, Co., Ltd.

Korea Electric Power Corporation

Hanmi Pharm. Co., Ltd.

Jin Young Kim

Hyoung-Juhn Kim

Jong Hyun Jang

Sung Jong Yoo

Hyun Seo Park

Chang Hoon Lee

Man Tae Hwang

Ki Tae Kim

Jin Soo Lee

So Young Lee

Min Su Park

Doo Hyun Park

Young Bok Son

Jae Kyum Kim

Sung Hwa Lee

Kie Tak Hyun

Jonghee Han

Seung Jae Lee

Suk Woo Nam

Ju Hoon Yoon

Sung Kyu Kim

Choon Heung Lee

Sang Mi Lee

No Ma Kim

Jin Han Kim

Sung Pil Yoon

Tae Hoon Lim

Glenn A Rinne

Seungjae Lee

Jong Sik Paek

Seong Min Seo

Ji Young Chung

Min Su Kim

Seong Ho Kang

Tae Hun Kim

Kyungah Lee

Dong Hyun Lee

Seung Min Lee

Jong Min Kim

Se Chang Kwon

Sung Youb Jung

Dong Ho Lee

Chang-Joo Kim

Kyung-Jin Lee

Won Hee Kim

Dong Soo Lee

Hyun Joong Yu

Dae Jin Kim

Hee Soo Kim

In Young Choi

Hee-Young Park

Hoi Kil Jeong

Joo Hwan Sung

Gun Ho Ha

Jin Wook Seo

Chang Ho Yun

Moo Hyun Ko

Hae Seock Yang

Jong Su Choo

Myung Sig Yoo

Kyeong Seon Jeong

Jin Hyouk Shin

Il Joong Kim

Yun Hee Park

Se Woong Cha

Dirk Henkensmeier

Yoon Joo Kim

No Sun Park

Ro Mi Lee

Dong Jin Kim

Moon Seok Chun

Yun Kwon Jung

Chang Won Yoon

Sungkyu Kim

Hyung Chul Ham

Hong Soo Choi

Won Tae Kim

Hong Gon Kim

Yong Min Song

Bong Soo Kim

Hye Jin Lee

Nayoung Kim

Yu Jin Kim

Kyung Chang Seo

Sung Jin Lee

Eun Ae Cho

Sung Woo Choi

Dong Wook Lee

Jeong Han Kim

Jun Seok Ko

Sungmin Park

Jin Won Lee

Soonho Ahn

Sung Su Park

Seung Su Kim

Hyun Uk Kim

Hyeong In Choi

Myung Hyun Jang

Heung Yeal Choi

A semiconductor device with redistribution layers formed utilizing dummy substrates is disclosed and may include forming a first redistribution layer on a first dummy substrate, forming a second redistribution layer on a second dummy substrate, electrically connecting a semiconductor die to the first redistribution layer, electrically connecting the first redistribution layer to the second redistribution layer, and removing the dummy substrates. The first redistribution layer may be electrically connected to the second redistribution layer utilizing a conductive pillar. An encapsulant material may be formed between the first and second redistribution layers. Side portions of one of the first and second redistribution layers may be covered with encapsulant. A surface of the semiconductor die may be in contact with the second redistribution layer. The dummy substrates may be in panel form. One of the dummy substrates may be in panel form and the other in unit form.

Semiconductor device with redistribution layers formed utilizing dummy substrates

Proposed is a method of compensating data, the method including: acquiring a plurality of initial scan shots by scanning a target object onto which a predetermined pattern is projected; detecting a non-scan region on the basis of the plurality of initial scan shots; and acquiring at least one compensated scan shot by additionally scanning at least one portion of the target object when the non-scan region is detected.

Method of compensating data and system for compensating data using same

Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.

Semiconductor device using EMC wafer support system and fabricating method thereof

The present disclosure relates to a catalyst for electrochemical synthesis of ammonia, which includes a metal sulfide, a method for preparing the same and a method for regenerating the same.

Catalyst for electrochemical synthesis of ammonia, method for preparing same, and method for regenerating same

The present disclosure relates to a method for preparing a catalyst for a fuel cell, a catalyst for a fuel cell and a fuel cell including the same. More specifically, the catalyst for a fuel cell according to the present disclosure, wherein ruthenium chalcogenide including the 1T phase exists as single-walled nanotubes, can reduce manufacturing cost by exhibiting superior catalytic activity so as to replace the existing platinum catalyst and can significantly improve stability.

Catalyst for fuel cell, fuel cell comprising the same and preparation method of the catalyst for fuel cell

The present invention relates to a microrobot-based biomimetic system for delivering a drug or cell, organizing microorgans, and controlling fluid flow. The microrobot-based biomimetic system according to one aspect of the present invention comprises: a network for interconnecting microorgans constituting a biometric organ model; a microrobot for delivering a targeted drug or cell while moving in the network; and a magnetic field control unit for controlling an operation of the microrobot.

Microrobot-based biomimetic system

Disclosed is a guidewire steering micro-robot. The guidewire steering micro-robot includes a guidewire, and a steering unit provided at an end portion of the guidewire, the steering unit including a magnetic body to control and steer a position of the guidewire by an external magnetic field.

Guidewire steering micro-robot

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Electronic device package and fabricating method thereof

A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.

Stiffener package and method of fabricating stiffener package

A modifying agent, a modified conjugated diene polymer prepared using the same, a method for preparing a modified conjugated diene polymer, and a rubber composition including a modified conjugated diene polymer are disclosed herein. In some embodiments, a modifying agent comprises a compound represented by formula 1. The modifying agent is capable of improving processability of a rubber composition including the polymer prepared using the modifying agent. Fuel consumption properties of a car using tires including the rubber composition may be improved.

Modifying agent and modified conjugated diene polymer prepared by using the same

A rubber composition having excellent abrasion resistance and improved viscoelasticity properties, and a tire manufactured using the same are disclosed herein. In some embodiments, a rubber composition includes a first synthetic rubber and a second synthetic rubber, and has an interaction parameter (χ) defined by Mathematical Formula 1 at room temperature is 2.0×10or more. The first synthetic rubber is a solution-polymerized modified conjugated diene-based rubber which has a 1,2-vinyl bond content of 50 wt % or more and includes a functional group bonded to at least one terminal, and the second synthetic rubber is a conjugated diene-based rubber which has a 1,2-vinyl bond content of less than 50 wt %.

Rubber composition and molded article manufactured therefrom

Disclosed is a magnetic-piezoelectric micro robot capable of a hyperthermia treatment, an electrotherapy and a cell therapy. The magnetic-piezoelectric micro robot includes a body and a stimulus generating layer formed at a surface of the body including a magnetic particle and a piezoelectric particle and generating heat from the magnetic particle and generating an electrical stimulus from the piezoelectric particle by an external stimulus, wherein one of a hyperthermia treatment by the magnetic particle or an electrotherapy by the piezoelectric particle is performed or both are performed simultaneously.

Magnetic-piezoelectric micro robot

Provided is a fluorine-doped tin oxide support, a platinum catalyst for a fuel cell having the same, and a method for producing the same. Also described is a high electrical conductivity and electrochemical durability by doping fluorine to the tin oxide-based support through an electrospinning process. Thus, while resolving a degradation issue of the carbon support in the conventional commercially available platinum/carbon (Pt/C) catalyst, what is designed is to minimize an electrochemical elution of dopant or tin, which is a limitation of the tin oxide support itself and has excellent performance as a catalyst for a fuel cell.

Fluorine-doped tin oxide support and Pt catalyst for fuel cell comprising the same

Disclosed are a cosmetic composition having increased skin contact and makeup persistence and a method of manufacturing the same. The method includes: forming a powder continuous phase by rapidly mixing a powder and a film-forming agent; and obtaining a cosmetic composition in which a surface of the powder is compounded with the film-forming agent by heating the powder continuous phase for a predetermined time. In an embodiment, the cosmetic composition is manufactured by the method. In an embodiment, the cosmetic composition includes 5 wt % to 30 wt % of a powder, 0.1 wt % to 10 wt % of a film-forming agent, 10 wt % to 30 wt % of a silicone oil, and 0.1 wt % to 10 wt % of a spherical powder.

Cosmetic composition having increased skin contact and makeup persistence and method of manufacturing same

Growing community of inventors

Seoul, South Korea

Jin Young Kim