Samsung Electronics Co., Ltd.

Jin-Yeol Yang

Hyung-Su Son

Dong-Su Han

Hae-Gu Lee

Sung-Il Cho

Sang-Young Kim

Hoon Sohn

Seung-Weon Ha

Youn-jo Mun

Yun-Kyu An

Soon-Kyu Hwang

A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.

X-ray topographic apparatus and substrate processing system using the apparatus

Laser processing method, substrate dicing method and substrate processing system for performing the same

A surface inspection apparatus and method of inspecting chip surfaces includes a laser generator that generates a periodic CW laser and is transformed into an inspection laser beam having a beam size smaller than a surface size of the chip. Thus, the inspection laser beam is irradiated onto a plurality of the semiconductor chips such that the semiconductor chips are partially and simultaneously heated. Thermal waves are detected in response to the inspection laser beam and thermal images are generated corresponding to the thermal waves. A surface image is generated by a lock-in thermography technique and hold exponent analysis of the thermal image, thereby generating surface image in which a surface defect is included. Time and accuracy of the surface inspection process is improved.

Surface inspection apparatus for semiconductor chips

Growing community of inventors

Cheonan-si, South Korea

Jin-Yeol Yang