Promos Technologies, Inc

Jin-Yang Huang

Hung-Kwei Liao

Ming-Sheng Tung

Tza-Hao Wang

A metal etching process is described. A substrate having a dielectric layer thereon is provided. An aluminum-copper alloy layer is formed on the dielectric layer. A hard mask layer is formed on the aluminum-copper alloy layer. A patterned photoresist layer is formed on the hard mask layer and then the hard mask layer is patterned. A thermal treatment process is performed. The thermal treatment process is carried out at a temperature of more than 300&#xb0; C. for a period of at least 3 minutes. Thereafter, the aluminum-copper alloy layer is etched using the patterned hard mask layer as an etching mask. Due to the thermal treatment, the metal precipitate (CuAl) within the aluminum-copper alloy layer is eliminated and hence the metal etching process is improved.

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Taipei County, Taiwan

Jin-Yang Huang