Samsung Display Co., Ltd.

Hana Micron Inc.

Jin Wook Jeong

Dong Hoon Kim

Sang Hoon Yim

Jinsook Bang

Sun Young Park

Kwan Hee Lee

Hyun Joo Kim

Jeong Hwan Kim

Jinyoung Choi

Min Chul Shin

Byoung-Hee Park

Yong Duck Son

Myung Koo Hur

Jin Sook Bang

Eun Jeong Hong

Eunjeong Hong

Hee Bong Lee

Hyun Woo Lee

Young Seo Park

Jin Young Ock

Jin Young Choi

Hyun Gue Shim

An organic light-emitting display device includes: a plurality of pattern electrodes; a hole-transporting layer disposed on the plurality of pattern electrodes; a plurality of emission layers disposed on the hole-transporting layer and overlapping the plurality of pattern electrodes, respectively; a common electrode disposed on the emission layers; and a first auxiliary layer disposed between a first one of the pattern electrodes and a first one of the emission layers, wherein the first emission layer forms an interface with the hole-transporting layer or the first auxiliary layer, the interface having a hole barrier equal to or less than about 0.1 eV, wherein the hole-transporting layer and the first auxiliary layer have a hole mobility equal to or less than about 1.0×10cm/V·s.

Organic light-emitting display device

A display device includes a substrate that includes a display area and a non-display area; a mask support that is disposed in the non-display area of the substrate; a sealant that is disposed in the non-display area of the substrate and is disposed between the mask support and the display area; an insulating layer that is disposed between the sealant and the mask support; and a plurality of grooves that are formed by removing at least a part of the insulating layer.

Display device

A display apparatus includes: a base substrate; a thin film transistor disposed on the base substrate and including an active pattern; an insulating layer disposed on the active pattern of the thin film transistor; a connection electrode disposed on the insulating layer, and electrically connected to the thin film transistor, wherein the connection electrode includes a curved wiring portion; a first via insulating layer covering the connection electrode; a first electrode disposed on the first via insulating layer; a light emitting layer disposed on the first electrode and at least partially overlapping the connection electrode; and a second electrode disposed on the light emitting layer.

Display apparatus

A method of driving a display panel in an organic light-emitting display device is provided. The method determines whether a single color image is displayed on the display panel or a multiple color image is displayed on the display panel, applies an initialization voltage, for initializing an anode of an organic light-emitting element included in a non-light-emitting pixel, to the anode of the organic light-emitting element included in the non-light-emitting pixel when the multiple color image is displayed on the display panel, and applies a lateral leakage prevention voltage that is higher than the initialization voltage to an anode of an organic light-emitting element included in an adjacent non-light-emitting pixel that is located within a reference distance from a light-emitting pixel when the single color image is displayed on the display panel.

Method of driving a display panel for an organic light-emitting display device

A fan-out wafer level package is disclosed, which includes: a redistribution layer; a semiconductor chip electrically connected with the redistribution layer through a bump; a protective member protecting the semiconductor chip, wherein a part of the protective member is removed such that the upper surface of the semiconductor chip is exposed in order to dissipate heat and prevent warpage; and an interconnector disposed outside the semiconductor chip at substantially the same level and having a lower part electrically connected with the redistribution layer and an upper part not being covered with the protective member, wherein the interconnector includes a metal core solder ball, the metal core solder ball includes a metal core and a solder buffer between the metal core and the protective member, and the metal core is formed of a combination of copper (Cu), nickel (Ni), and silver (Ag).

Metal core solder ball interconnector fan-out wafer level package

A 3D semiconductor device includes a conductive plate defining four sides and four recesses formed in the four sides, respectively. The conductive plate has first and second surfaces opposite to each other. A plurality of conductive leads are located in the recesses, respectively, and the conductive leads have first and second surfaces opposite to each other. A semiconductor die is attached onto the central area of the conductive plate. A plurality of conductive wires electrically connects the semiconductor die to the conductive leads. An encapsulant encloses, as in a capsule, the conductive plate, the conductive leads, the semiconductor die, and the conductive wires in such a manner that the first and second surfaces of the conductive plate and the first and second surfaces of the conductive leads are exposed to the outside.

Three dimensional semiconductor device

Growing community of inventors

Asan-si, South Korea

Jin Wook Jeong