Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Samsung Mobile Display Co., Ltd.

Samsung Sdi Co., Inc.

Hyupjinconnector Co., Ltd

Lg Display Co., Ltd.

Dongbu Electronics, Co. Ltd.

Yonsei University

Other

A-sen Company

Jin-Woo Park

Hun Rae Kim

Se-Ho Kim

Won-Se Lee

Tae-Min Kang

Seung-Yong Song

Ho-Kyoon Chung

Sang-Jin Pak

Seong-Taek Lee

Jang-hyuk Kwon

Jong-Hyuk Lee

Myung-Won Song

Sang-Woo Pyo

Ung-Soo Lee

Joo-Hyung Lee

Dong-Hoon Lee

Jae-Bon Koo

Jung-Ho Park

Min-Soo Kim

Seung-Kyu Lee

Yoon-Hyeung Cho

Seokhyun Lee

Dong-Jin Kim

Chul-Ho Kim

Sun-Young Jung

Won-Sik Hyun

Mu-Kyung Jeon

Hun Jung Kim

Kwan-Hee Lee

Jong-Ho Lee

Byung-Hee Kim

Won-Jong Kim

Dae-Kwang Jung

Tae-Soo Kim

Tae-Hun Kim

Jangwoo Lee

Han-Choon Lee

Seong-Taek Hwang

Won-Kyu Kwak

Donghan Kim

Seok Pil Lee

Mu-Hyun Kim

Tae-Hyeog Jung

Yoon-Chang Kim

Dong Kyu Kim

Jung-Hyun Cho

Seung-Bum Kim

Dong-Hwan Kim

Jongbo Shim

Cheol-Min Kim

Young Lyong Kim

Chi-Woo Kim

Ji Hwang Kim

Se-Hwan Park

Young-Rag Do

Kwang-Hee Lee

Yun-Je Oh

Jong Ho Lee

Do-Young Kim

Junho Lee

Kwan-Wook Jung

Jung-Hwan Kim

Kyoung-Hoon Kim

Jinho Lee

Hee-Seong Jeong

Un-Byoung Kang

Jongho Lee

Minseok Kim

Dongho Kim

Tae-Je Cho

Dong-Won Lee

Kiwon Kim

Su Seok Choi

Sun-Won Kang

Chul-Woo Park

Soo-Guy Rho

Jeong Min Moon

Kyung-Wook Kim

Jong-hyuk Lee

Noh-Min Kwak

Tae-hyung Kim

Yun-seok Choi

Joon-Ho Byun

Seok-Won Lee

Ae-Nee Jang

Jin-Hwan Jeon

Young-Cheol Joo

Yeongkwon Ko

Dong-In Ha

Sung-Won Park

Seok H Lee

Chang-Su Seo

Min-Soo Choi

Sung-Woo Park

Eun-Chul Ahn

Moon-Hee Park

Sungpil Ryu

Ho-Geon Song

Gangyoul Kim

Hyun Sub Kim

An organic light emitting diode display includes a substrate, a scan line on the substrate for transferring a scan signal, a data line crossing the scan line and for transferring a data signal, a driving voltage line crossing the scan line and for transferring a driving voltage, a switching thin film transistor coupled to the scan line and the data line, a driving thin film transistor coupled to a switching drain electrode of the switching thin film transistor, and an organic light emitting diode (OLED) coupled to a driving drain electrode of the driving thin film transistor, wherein a driving semiconductor layer of the driving thin film transistor is bent and in a plane substantially parallel to the substrate.

Organic light emitting diode display with bent semiconductor layer

A wearable photoluminescence sensor, which is portable and has improved sensitivity and accuracy, and a remote sensing apparatus comprising same, the disclosed wearable photoluminescence sensor includes a reflective support and a semipermeable filter disposed over and under translucent photodiodes, thus allows light of a second wavelength band, having the photoluminescence properties of getting lost or passing through, to be reflected again and thus maximally utilized, and thereby allows sensitivity and accuracy to be improved.

Wearable photoluminescence sensor and remote sensing apparatus comprising same

A semiconductor package includes: a lower package: an upper substrate on the lower package: and connection members connecting the lower package to the upper substrate, wherein the lower package includes: a lower substrate; and a lower semiconductor chip, wherein the upper substrate includes: an upper substrate body: upper connection pads combined with the connection members: and auxiliary members extending from the upper substrate body toward the lower substrate, wherein the connection members are arranged in a first horizontal direction to form a first connection member column, wherein the auxiliary members are arranged in the first horizontal direction to form a first auxiliary member column, wherein the first connection member column and the first auxiliary member column are located between a side surface of the lower semiconductor chip and a side surface of the lower substrate, and the first auxiliary member column is spaced apart from the first connection member column.

Semiconductor package and method of fabricating the same

A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.

Method for fabricating semiconductor package

Organic light emitting diode display with plurality of thin film transistors in portions of curved semiconductor layer

A semiconductor package includes a first substrate including a circuit pattern and a dummy pattern on an upper face of the first substrate, a solder ball, a second substrate on the first substrate, and an underfill material layer between the first and second substrates. The underfill material layer wraps around the solder ball. The dummy pattern is not electrically connected to the circuit pattern. The first substrate includes a solder resist layer on the circuit pattern and the dummy pattern. The solder resist layer includes a first opening for exposing at least a part of the circuit pattern. The solder ball is in the first opening and electrically insulated from the dummy pattern by the solder resist layer. The second substrate is electrically connected to the first substrate by the solder ball. The second substrate is electrically insulated from the dummy pattern by the solder resist layer.

Semiconductor package with dummy pattern not electrically connected to circuit pattern

A semiconductor package includes a first redistribution layer. A plurality of posts is disposed on the first redistribution layer. A semiconductor chip is disposed on the first redistribution layer between the plurality of posts. A second redistribution layer is formed on the plurality of posts and the semiconductor chip. A first memory stack is disposed on the second redistribution layer. A height of each of the plurality of posts extends from an upper surface of the first redistribution layer to a lower surface of the second redistribution layer.

Semiconductor package and method for fabricating the same

The present disclosure relates to a stretchable organic light-emitting diode and a manufacturing method thereof, the stretchable organic light-emitting diode including: a stretchable driving unit including a stretchable field effect transistor (FET); and a stretchable light-emitting unit including an elastic material on the stretchable driving unit.

Organic light emitting diode, and using stretchable light-emitting material and a manufacturing method of thereof

Provided is a flexible transcutaneous oxygen partial pressure sensor which may be closely attached to a skin, be used repeatedly for a long time, and have a highly reliable measurement value. The flexible transcutaneous oxygen partial pressure sensor of the present disclosure includes: an oxygen sensing film having one surface in contact with a skin; a light detecting portion including a light emitting portion which is positioned above a surface opposite to the one surface of the oxygen sensing film and includes a micro-light emitting diode (LED (&#x3bc;-LED)), and a light-receiving portion which includes an organic-photodiode (OPD); and a heater portion positioned between the oxygen sensing film and the light detecting portion, and supplying thermal energy to the skin in contact with the oxygen sensing film.

Flexible transcutaneous oxygen partial pressure sensor

Organic light emitting diode display with curved channel region

Organic light emitting diode display with scan line between storage capacitor and voltage line

Organic light emitting diode display with semiconductor layer having bent portion

Organic light emitting diode display with thin film transistors in portions of curved semiconductor layer

Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.

A semiconductor package includes a first semiconductor chip including a first surface and a second surface which face each other, an alignment pattern formed on the first surface, a first redistribution layer arranged on the first surface of the first semiconductor chip, a second redistribution layer arranged on the second surface of the first semiconductor chip, and electrically connected with the semiconductor chip, and a first dielectric layer including the alignment pattern between the first redistribution layer and the semiconductor chip, the alignment pattern overlapping the first surface of the first semiconductor chip.

Semiconductor package

Growing community of inventors

Yongin-si, South Korea

Jin-Woo Park