Samsung Electro-mechanics Co., Ltd.

Jin Woo Hahn

Soo Hwan Son

Sung Yong An

Byeong Cheol Moon

Ic Seob Kim

Myeong Gi Kim

So Yeon Song

Hwan Soo Lee

Myeong Gil Kim

Sung Lyoung Kim

Jae Hoon Lee

Sung Jin Park

Kang Heon Hur

Young Do Kweon

Ho Yoon Kim

Dong Jin Jeong

Jung Min Park

Hye Yeon Cha

Min Kyoung Cheon

Il Jin Park

Joon Hwan Kwag

Hyeog Soo Shin

Kyoung No Lee

Jeong Wook Kim

A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.

Multilayer electronic component

A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.

Composite electronic component and a board for mounting the same

There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40&#x2266;Ai:Ao&#x2266;1.03 is satisfied.

Multi-layered chip electronic component

Disclosed herein is a multilayer coil component including a copper-nickel mixture for an internal electrode, in which a nickel content in the internal electrode is adjusted to thereby optimize the area ratio of nickel to copper while the copper-nickel mixture is used for a material for the internal electrode of the multilayer coil component, thereby preventing deterioration in characteristics of the multilayer coil component, so that ferrite characteristics of the multilayer coil component, such as, impedance (Z), inductance (L), and the like, can be improved.

Multilayer coil component

A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.

Composite electronic component and board with the same mounted thereon

There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 &#x3bc;m&#x2266;Tg&#x2266;7 &#x3bc;m, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.

The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.

Chip inductor and method for manufacturing the same

Disclosed herein are a ferrite composition for a high frequency bead in that a part of Fe in M-type hexagonal ferrite represented by BaFeOis substituted with at least one metal selected from a group consisting of 2-valence, 3-valence and 4-valence metals, as well as a chip bead material using the same. According to embodiments of the present invention, the dielectric composition is characterized in that a part of Fe as a constituent of M-type hexagonal barium ferrite is substituted by other metals, to thus decrease a sintering temperature to 920&#xb0; C. or less without using any additive for low temperature sintering. Moreover, because of high SRF properties, the inventive composition is applicable to a multilayer type chip bead used at a high frequency of more than several hundreds MHz and a magnetic antenna.

Ferrite composition for high frequency bead and chip bead comprising the same

There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1&#x2266;Ts:Te&#x2266;0.3 is satisfied.

There are provided a composition for a ceramic electronic component having excellent sinterability and magnetic characteristics (Q), a manufacturing method thereof, and an electronic component using the same. The magnetic material composition for the ceramic electronic component is composed of ferric oxide (FeO) of 47.0 to 49.0 parts by mole, nickel oxide (NiO) of 16.0 to 24.0 parts by mole, zinc oxide (ZnO) of 18.0 to 25.0 parts by mole, and copper oxide (CuO) of 7.0 to 13.0 parts by mole, wherein a portion of ferric oxide may be substituted with boron oxide (BO). The ceramic electronic component manufactured by using the magnetic material composition for the ceramic electronic component has an excellent Q.

Magnetic material composition for ceramic electronic component, method of manufacturing the same, and ceramic electronic component using the same

Disclosed herein is a multilayer type power inductor including: a plurality of body layers including internal electrodes and having magnetic material layers stacked therein; and a plurality of gap layers, wherein the gap layer has an asymmetrical structure. In the multilayer type power inductor, portions that are in contact with the body layers have, a non-porous structure, which is a dense structure, and portions that are not in contact with the body layers have a porous structure, such that the gap layer has the asymmetrical structure. Therefore, a magnetic flux propagation path in a coil is dispersed to suppress magnetization at a high current, thereby making it possible to improve a change in inductance (L) value according to the application of current.

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Gyunggi-do, South Korea

Jin Woo Hahn