Advanced Micro Devices Corporation

Globalfoundries Inc.

Jin Wang

Elfido Coss, Jr

Christopher Allen Bode

Alexander James Pasadyn

Robert J Chong

Brian K Cusson

Gregory A Cherry

Naomi M Jenkins

Thomas J Sonderman

Qinghua He

Richard J Markle

Michael Lee Miller

Richard P Good

Eric Omar Green

Si-Zhao J Qin

A method, apparatus, and a system for performing an adaptive state estimation process for processing semiconductor wafers. A processing of a first workpiece is controlled using a process controller and a processing tool. Manufacturing data relating to the processing of the first workpiece is acquired. Status data relating to the manufacturing data is acquired. The status data includes data relating to the source of the manufacturing data. A state of a process controller or a processing tool is determined based upon the status data and the manufacturing data.

Enhanced state estimation based upon information credibility

A method and an apparatus are provided for applying a self-adaptive filter to a drifting process. The method includes processing a workpiece, measuring an output characteristic of the processed workpiece and modifying a previous estimated process state based at least on the measured output characteristic. The method further includes estimating a next process state based at least on the modified previous estimated process state.

Applying a self-adaptive filter to a drifting process

The present invention provides a method and apparatus for detecting step and impulse disturbances. The method includes determining a pattern based on a plurality of probabilities associated with a corresponding plurality of wafer processing parameters and determining a type of a disturbance based upon the pattern.

Method and apparatus for fast disturbance detection and classification

A method and an apparatus are provided for adjusting a sampling protocol in an adaptive control process. The method comprises determining a performance value based on a measurement associated with at least one or more previously processed workpieces, adjusting a sampling protocol for one or more processed workpieces based on the determined performance value, and measuring the one or more processed workpieces according to the sampling protocol to provide one or more measurements. The method further comprises adjusting at least one of a process model and a control parameter based on at least a portion of the one or more measurements.

Adjusting a sampling protocol in an adaptive control process

A method and apparatus is provided for fault detection and classification based on calculating distances between data points. The method comprises receiving a data sample representative of measurements of one or more variables associated with a process operation, determining a distance between the data sample and one or more data points of a history data of the process operation and detecting a fault associated with the process operation based on the distance between the data sample and the one or more data points of the history data.

Fault detection and classification based on calculating distances between data points

A method and an apparatus are provided for conflict resolution among a plurality of controllers. The method includes receiving a first control instruction from a first process controller to process a workpiece, receiving a second control instruction from a second process controller to process the workpiece and adjusting at least one of the first control instruction and the second control instruction to process the workpiece to achieve a desired process goal.

Conflict resolution among multiple controllers

A method includes defining a model of a process for manufacturing a device, the process including a plurality of steps. A plurality of inline process targets are defined for at least a subset of the process steps. The model relates the inline process targets to a plurality of process output parameters. A first set of probabilistic constraints for the inline process targets is defined. A second set of probabilistic constraints for the process output parameters is defined. An objective function is defined based on the model and the plurality of process output parameters. A trajectory of the process output parameters is determined by optimizing the objective function subject to the first and second sets of probabilistic constraints for each process step to determine values for the inline process targets at each process step, the optimization being iterated after completion of each process step for the remaining process steps.

Probability constrained optimization for electrical fabrication control

A method includes performing at least one process for forming a feature of a semiconductor device in accordance with an operating recipe. An electrical performance characteristic of the feature is measured. The measured electrical performance characteristic is compared to a target value for the electrical performance characteristic. At least one parameter of the operating recipe is determined based on the comparison. A system includes a process tool, a metrology tool, and a controller. The process tool is configured to perform at least one process for forming a feature of a semiconductor device in accordance with an operating recipe. The metrology tool is configured to measure an electrical performance characteristic of the feature. The controller is configured to compare the measured electrical performance characteristic to a target value for the electrical performance characteristic and determine at least one parameter of the operating recipe based on the comparison.

Method and apparatus for controlling a fabrication process based on a measured electrical characteristic

A method and an apparatus for performing process control based upon a metrology delay. A process step is performed upon a first workpiece. Metrology data related to the first workpiece is acquired. A control adjustment based upon the metrology data is determined. A magnitude of the control adjustment is modified based upon a time period. The time period is defined by a first time frame relating to processing the first workpiece and a second time frame relating to acquiring metrology data related to the first workpiece.

Process control based upon a metrology delay

A method is provided for a process control based on tool health data. The method comprises processing a workpiece using a processing tool, receiving trace data associated with the processing of the workpiece from the processing tool and determining at least one value associated with a health of a portion of the processing tool based on at least a portion of the received trace data. The method further comprises adjusting processing of another workpiece based on the determined health value.

Process control based on tool health data

A method and apparatus is provided for identifying a cause of a fault based on controller output. The method comprises processing at least one workpiece under a direction of the controller and detecting a fault associated with the processing of the at least one workpiece. The method further includes determining a plurality of possible causes of the detected fault, identifying a more likely possible cause out of the plurality of possible causes, providing fault information associated with the identified more likely possible cause to the controller. The method further includes providing fault information associated with the identified more likely possible cause to the controller. The method further comprises adjusting the processing of one or more workpieces to be processed next based on the fault information provided to the controller. The method further includes generating prediction data associated with processing of the next workpieces, and comparing the prediction data to processing data associated with the processing of the next workpieces to identify a possible cause of the fault.

Identifying a cause of a fault based on a process controller output

A method and an apparatus for dynamic targeting for a process control system. A process step is performed upon a first workpiece in a batch based upon a process target setting. The process target setting comprises at least one parameter relating to a target characteristic of the first workpiece. Manufacturing data relating to processing of the first workpiece is acquired. The manufacturing data comprises at least one of a metrology data relating to the processed first workpiece and a tool state data relating to the tool state of a processing tool. Electrical data relating to the processed first workpiece is acquired at least partially during processing of a second workpiece in the batch. The process target setting is adjusted dynamically based upon a correlation of the electrical data with the manufacturing data.

Dynamic targeting for a process control system

A method and an apparatus are provided for adjusting a sampling rate based on a state estimation result. The method comprises receiving metrology data associated with processing of workpieces, estimating a next process state based on at least a portion of the metrology data and determining an error value associated with the estimated next process state. The method further comprises processing a plurality of workpieces based on the estimated next process state and adjusting a sampling protocol of the processed workpieces that are to be measured based on the determined error value.

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Austin, TX, United States of America

Jin Wang