Samsung Electro-Mechanics Co., Ltd.

Jin Uk Cha

Ki Yong Lee

Ji Hyuk Lim

Chang Min Lee

Hye Sung Yoon

Seon A Jang

Suk Jin Ham

Mi Yang Kim

Hee Suk Chung

Se Yoon Park

Eun Ju Yang

Gyu Seok Kim

A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A, a content of magnesium (Mg) included in the cover portion is C, and a content of magnesium (Mg) included in the margin portion is M, 0<A<M≤Cand A/C≤0.60 are satisfied.

Capacitor component

A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1≤C1 and A1/C1≤0.60 are satisfied.

Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.

Printed circuit board and method of manufacturing the same

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Suwon-si, South Korea

Jin Uk Cha