Samsung Electro-mechanics Co., Ltd.

Jin Sung Chun

Seul Gi Kim

Hae Suk Chung

Kyeong Jun Kim

Byung Sung Kang

Ho In Jun

Woo Chul Shin

Young Hoon Song

Yun Jung Park

Hyo Kyong Seo

Chae Min Park

Jun Ho Yun

Chang Yong Choi

A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO) and a shell portion including the additive and formed on a surface of the core portion.

Method of producing core-shell particles and multilayer ceramic electronic component including core-shell particles

A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, a first plating layer disposed on the electrode layer, and a conductive resin layer disposed on the first plating layer. The first plating layer has surface roughness higher at an interface with the conductive resin layer than at an interface with the electrode layer, and the conductive resin layer includes a conductive metal and a base resin.

Multilayer electronic component

A multilayer electronic component includes: a body including first and second dielectric layers alternately disposed in a first direction; and external electrodes disposed on opposing end surfaces, respectively. A first internal electrode exposed to a first end surface and a first dummy pattern spaced apart from the first internal electrode and exposed to a second end surface are disposed on the first dielectric layer. A second internal electrode exposed to the second end surface and a second dummy pattern spaced apart from the second internal electrode and exposed to the first end surface are disposed on the second dielectric layer. The first and second internal electrodes include first and second main portions, respectively, and the first main portion and the second main portion are arranged in a staggered manner in a width direction.

A dielectric composition includes a ceramic powder, a high polymerization binder, and a low polymerization binder type dispersant having a degree of polymerization between 100 and 1,000.

Dielectric composition and capacitor component using the same

A multilayer electronic component includes a body comprising a capacitance-forming portion including a dielectric layer and a plurality of internal electrodes layered with the dielectric layer interposed therebetween, and upper and lower cover portions disposed on upper and lower surfaces of the capacitance-forming portion, respectively; and external electrodes disposed on the body and electrically connected to at least some of the plurality of internal electrodes, respectively, wherein at least one of the upper cover portion and or the lower cover portion has a step structure, and the step structure has a shorter length and width as compared to the capacitance-forming portion.

A method of manufacturing a multilayer ceramic capacitor includes forming a water-repellent coating layer on surfaces of a multilayer ceramic capacitor having an internal electrode, a dielectric layer, and an external electrode; and removing at least a portion of the water-repellent coating layer formed on the surfaces of the external electrode such that another portion of the water-repellent coating layer remains on surfaces of the dielectric layer. The external electrode has first and second surfaces opposing each other in a thickness direction, third and fourth surfaces opposing each other in a width direction, and fifth and sixth surfaces opposing each other in a length direction.

Method of manfacturing multilayer ceramic capacitor and multilayer ceramic capacitor

A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.

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Suwon-si, South Korea

Jin Sung Chun