Samsung Electronics Co., Ltd.

Jin-Suk Hong

Yun-seok Choi

Eun-Seok Lee

Chang-Gil Ryu

Geun-Young Song

Yong-Sun Ko

Hyun-Chul Kim

Kun-Tack Lee

Yong-Jhin Cho

Gyung-Jin Min

Jae-Chang Lee

Ji-Hoon Jeong

In-Gi Kim

Kyoung-hwan Kim

Il-Sang Lee

Myung-Woo Kim

Yong-Myung Jun

Byung-Bok Kang

Seok-Min Kang

Bon-Ok Koo

Sung-Ki Roh

Ki-Yeon Chu

Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.

Substrate cleaning apparatus

A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

Polishing head and polishing carrier apparatus having the same

A sealing member includes a body having a ring shape, a lower contacting portion protruding from a lower end of the body and having at least one recess, the recess provided in a lower surface of the lower contacting portion and extending in a radial direction of the body, and an outer contacting portion protruding outwards from the body along an outer side portion of the body.

Sealing member and substrate processing apparatus including the same

In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

Method of inspecting a surface of a substrate and apparatus for performing the same

Growing community of inventors

Hwaseong-si, South Korea

Jin-Suk Hong