Samsung Electronics Co., Ltd.

Skhynix Inc.

Other

Cellontech Co., Ltd.

Jin Sub Kim

Jin Hyun Cho

Sung Ki Kim

Joon Seong Kang

Jong Won Lee

Dong Jin Park

Hyong Jun Yoo

Min Chul Jung

Baek Seok Ko

Sun Woo Kim

Seo Joon Lee

Hyun Jun Jung

Kye Hoon Lee

Ik Soo Kim

Yong Jin Shin

Sang Jun Choi

Jun Seok An

Kyoung-Hee Kim

Jun Kwan Kim

Sru Kim

Heong Seog Lee

Jung Kyun Kim

Cheong Ho Chang

Woo Choel Noh

Dong Sam Suh

Jin Soo Pyo

Byung Jo Kang

Ji Chul Yoo

Soon Hyun Kwon

A storage device may set a write buffer including one or more of a plurality of first type memory blocks. And the storage device may determine whether a threshold condition is satisfied when a power off request is received, and add one or more target memory blocks selected from among a plurality of second type memory blocks to the write buffer when it is determined that the threshold condition is satisfied.

Storage device controlling write buffer while processing power off request and method of operating the storage device

The present technology includes a method of operating a controller that controls a semiconductor memory device including a plurality of memory blocks. The method includes receiving a read request for data included in any one memory block among the plurality of memory blocks from a host, and controlling the semiconductor memory device to read data corresponding to the read request using a read-history table. The read-history table includes read voltages used for a plurality of read pass operations for the any one memory block, respectively.

Semiconductor memory device, controller, memory system and method of operating the same

Disclosed herein is a cable device including a cable configured to transmit power and a connector connected to the cable, the cable device including a connector with improved electromagnetic interference (EMI) shielding performance. The cable device includes a cable, and a connector connected to the cable. The connector includes a printed circuit board including a ground electrode, and a shield case provided to accommodate the printed circuit board therein, the shield case including a contact portion provided in direct contact with the ground electrode.

Electrical and optical cable device with shielding shell grounded to an internal circuit board

A semiconductor device includes a lower electrode on a substrate, a capacitor dielectric film extending on the lower electrode along a side surface of the lower electrode that is perpendicular to the substrate, an upper electrode on the capacitor dielectric film, an interface layer including a hydrogen blocking film and a hydrogen bypass film on the upper electrode, the hydrogen blocking film including a conductive material, and a contact plug penetrating the interface layer and electrically connected to the upper electrode.

Semiconductor device

Disclosed is a medical material manufactured using collagen and a method of manufacturing the same. The method includes (1) preparing collagen using distilled water as a solvent, (2) filling a syringe with the prepared collagen and then spinning the collagen through a syringe needle, (3) immediately immersing the spun collagen in a cross-linking solution, which is a mixture including therein a hyperosmotic agent and a cross-linking agent mixed with each other, (4) removing and then washing the collagen after cross-linking is completed, and (5) removing and then drying the collagen after the washing is completed. When the collagen is spun and processed into the form of a thread and the spun thread is then cross-linked, the cross-linked collagen thread has increased strength compared to before cross-linking, and the shape thereof is retained in an aqueous solution.

Medical material produced using collagen and method for producing same

Provided is a cable device including an optical cable capable of power transmission and a connector coupled with the optical cable, and having improved electromagnetic shielding performance. The cable device includes a cable; and a connector coupled to the cable, wherein the connector includes a printed circuit board (PCB) including a ground electrode, a shield case provided to accommodate the PCB and include a first face facing a mounting surface of the PCB and a second face perpendicular to the first face, and an elastic member arranged between the PCB and the shield case and provided to contact the ground electrode and the second face of the shield case so as to ground the shield case.

Cable device

A manufacturing method that forms a multilayer thin film on the inner surface of a housing forming a transparent appearance of an electronic product to provide a deep metal texture and an electronic product having a metal texture provided at the inner surface of the housing. The multilayer thin film manufacturing method includes reforming an inner surface of a housing having an outer surface and the inner surface through plasma processing, depositing at least one hardness reinforcement layer on the inner surface, and depositing a color layer on the hardness reinforcement layer.

Multilayer thin film manufacturing method and electronic product

Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.

Method of manufacturing multi-layer thin film, member including the same and electronic product including the same

A display module including a backlight to more effectively dissipate heat generated at light emitting diodes (LEDs) and heat dissipation units to effectively dissipate heat generated at driver chips and prevent movement of the driver chips by attaching porous fillers to the heat dissipation units, and a display apparatus having the same are provided. The display module includes a display panel, a backlight disposed on a rear side of the display panel and including a plurality of printed circuit boards, a bottom chassis adapted to accommodate the backlight unit and provided with a plurality of seating grooves, a driving printed circuit board, a plurality of flexible printed circuit films which electrically connect the display panel and the driving printed circuit board, at least one heat dissipater disposed on an opposite surface of a corresponding one of the flexible printed circuit and provided with a porous filler.

Display module and display apparatus having the same

An injection mold includes a first mold part provided with a first mold surface and a second mold part provided with a second mold surface to form a cavity together with the first mold surface. Cooling channels along which a cooling fluid flows are provided in at least one of the first mold part and the second mold part, and a heat generating layer which receives power and then generates heat is disposed on the inner surfaces of the cooling channels and serves as a heater.

Injection mold

An injection molding apparatus is provided. The injection molding apparatus includes a mold, a plate heater mounted to the mold to heat the mold, and a cooling passage provided above or below the plate heater.

Injection molding apparatus having a plate heater and having a cooling passage or an insulation space

A liquid crystal display device includes a liquid crystal panel, a protection panel arranged a predetermined distant from the liquid crystal panel, and a flow control device to impart turbulence to an air flow in a channel, which is defined between the liquid crystal panel and the protection panel.

Growing community of inventors

Seongnamn-si, South Korea

Jin Sub Kim